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13. 
Cover image for High Dielectric Constant Materials VLSI MOSFET Applications
High Dielectric Constant Materials VLSI MOSFET Applications
Author 
Huff, H.R. editor. Gilmer, D.C. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b137574
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14. 
Cover image for Gettering Defects in Semiconductors
Gettering Defects in Semiconductors
Author 
Perevoschikov, Victor A. author. Skoupov, Vladimir D. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/3-540-29499-6
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15. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-75708-7
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16. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3627-0
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17. 
Cover image for Printed Flexible Sensors Fabrication, Characterization and Implementation
Printed Flexible Sensors Fabrication, Characterization and Implementation
Author 
Nag, Anindya. author. Mukhopadhyay, Subhas Chandra. author. Kosel, Jurgen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-13765-6
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18. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09111-2
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19. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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20. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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21. 
Cover image for Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Author 
Kaltenbacher, Manfred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-40170-1
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22. 
Cover image for Nanowire Field Effect Transistors: Principles and Applications
Nanowire Field Effect Transistors: Principles and Applications
Author 
Kim, Dae Mann. editor. Jeong, Yoon-Ha. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-8124-9
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23. 
Cover image for The Liquid Crystal Display Story 50 Years of Liquid Crystal R&D that lead The Way to the Future
The Liquid Crystal Display Story 50 Years of Liquid Crystal R&D that lead The Way to the Future
Author 
Koide, Naoyuki. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54859-1
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24. 
Cover image for Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Author 
Fan, Jiyang. author. Chu, Paul K. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08726-9
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