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13. 
Cover image for Microfluidics Based Microsystems Fundamentals and Applications
Microfluidics Based Microsystems Fundamentals and Applications
Author 
Kakaç, S. editor. Kosoy, B. editor. Li, D. editor. Pramuanjaroenkij, A. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-90-481-9029-4
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14. 
Cover image for Food engineering laboratory manual
Food engineering laboratory manual
Author 
Barbosa-Cnovas, Gustavo V. Ma, Li,{dollar}d1963- ort. yaz. Barletta, Blas, ort. yaz.
Preferred Shelf Number 
TP 372.5 B37 1997
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15. 
Cover image for An Economic Analysis on Automated Construction Safety Internet of Things, Artificial Intelligence and 3D Printing
An Economic Analysis on Automated Construction Safety Internet of Things, Artificial Intelligence and 3D Printing
Author 
Li, Rita Yi Man. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-5771-7
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16. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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17. 
Cover image for 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
Author 
Li, Simon. author. Fu, Yue. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0481-1
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18. 
Cover image for Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping.
Preferred Shelf Number 
TK7874.893 L53 2012
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19. 
Cover image for Li Livres du gouvernement des rois
Li Livres du gouvernement des rois
Author 
Colonna, Egidio. d., 1316
Preferred Shelf Number 
PC 13 C64 1966
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20. 
Cover image for Bioscience methodologies in physical chemistry : an engineering and molecular approach
Bioscience methodologies in physical chemistry : an engineering and molecular approach
Author 
D'Amore, Alberto, editor. Zaikov, Gennady E., editor.
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ONLINE
Electronic Access 
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21. 
Cover image for Chemical process in liquid and solid phases : properties, performance and applications
Chemical process in liquid and solid phases : properties, performance and applications
Author 
Jimňez, Alfonso, editor. Pourhashemi, Ali, editor.
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ONLINE
Electronic Access 
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22. 
Cover image for The textbook of nanoneuroscience and nanoneurosurgery
The textbook of nanoneuroscience and nanoneurosurgery
Author 
Kateb, Babak. Heiss, John D.
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ONLINE
Electronic Access 
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23. 
Cover image for Progress in organic and physical chemistry structures and mechanisms
Progress in organic and physical chemistry structures and mechanisms
Author 
Goloshchapov, Alexander N. Zaikov, G. E. (Gennadi? Efremovich), 1935- Lobanov, Anton V.
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ONLINE
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24. 
Cover image for Aerospace materials handbook
Aerospace materials handbook
Author 
Zhang, Sam. Zhao, Dongliang.
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