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133. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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134. 
Cover image for Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Author 
Imanaka, Yoshihiko. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b101196
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135. 
Cover image for Ordered Porous Nanostructures and Applications
Ordered Porous Nanostructures and Applications
Author 
Wehrspohn, Ralf B. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/b106900
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136. 
Cover image for Principles and Applications of NanoMEMS Physics
Principles and Applications of NanoMEMS Physics
Author 
Santos, Héctor J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b136228
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137. 
Cover image for Thin Films and Heterostructures for Oxide Electronics
Thin Films and Heterostructures for Oxide Electronics
Author 
Ogale, Satischandra B. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b136780
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138. 
Cover image for Fundamentals of Semiconductors Physics and Materials Properties
Fundamentals of Semiconductors Physics and Materials Properties
Author 
Yu, Peter Y. Cardona, Manuel. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137661
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139. 
Cover image for Ultrathin Magnetic Structures IV Applications of Nanomagnetism
Ultrathin Magnetic Structures IV Applications of Nanomagnetism
Author 
Heinrich, Bretislav. editor. Bland, J. Anthony C. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138704
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