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169. 
Cover image for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author 
Lim, Sung Kyu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330852.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9542-1
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170. 
Cover image for 3D Video Coding for Embedded Devices Energy Efficient Algorithms and Architectures
3D Video Coding for Embedded Devices Energy Efficient Algorithms and Architectures
Author 
Zatt, Bruno. author. Shafique, Muhammad. author. Bampi, Sergio. author. Henkel, Jörg. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332110.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-6759-5
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171. 
Cover image for Handbook of Signal Processing Systems
Handbook of Signal Processing Systems
Author 
Bhattacharyya, Shuvra S. editor. Deprettere, Ed F. editor. Leupers, Rainer. editor. Takala, Jarmo. editor. SpringerLink (Online service)
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ONLINE(332139.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-6859-2
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172. 
Cover image for Modeling, Analysis and Optimization of Network-on-Chip Communication Architectures
Modeling, Analysis and Optimization of Network-on-Chip Communication Architectures
Author 
Ogras, Umit Y. author. Marculescu, Radu. author. SpringerLink (Online service)
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ONLINE(335726.1)
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-3958-1
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173. 
Cover image for Multicore Systems On-Chip: Practical Software/Hardware Design 2nd Edition
Multicore Systems On-Chip: Practical Software/Hardware Design 2nd Edition
Author 
Ben Abdallah, Abderazek. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(336495.1)
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http://dx.doi.org/10.2991/978-94-91216-92-3
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