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1. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76534-1
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Cover image for Self-Consistent Methods for Composites Vol.1: Static Problems
Self-Consistent Methods for Composites Vol.1: Static Problems
Author 
Kanaun, S. K. author. Levin, V. M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6664-1
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3. 
Cover image for Recent Advances in Adsorption Processes for Environmental Protection and Security
Recent Advances in Adsorption Processes for Environmental Protection and Security
Author 
Mota, José Paulo. editor. Lyubchik, Svetlana. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6805-8
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4. 
Cover image for Hansen solubility parameters a user's handbook
Hansen solubility parameters a user's handbook
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Hansen, Charles M.
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5. 
Cover image for Springer Handbook of Electronic and Photonic Materials
Springer Handbook of Electronic and Photonic Materials
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Kasap, Safa. editor. Capper, Peter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-29185-7
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6. 
Cover image for Plasmonics: Fundamentals and Applications
Plasmonics: Fundamentals and Applications
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Maier, Stefan A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-37825-1
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7. 
Cover image for Rare Earth Oxide Thin Films
Rare Earth Oxide Thin Films
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Fanciulli, Marco. editor. Scarel, Giovanna. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137342
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8. 
Cover image for Diffusion in Solids Fundamentals, Methods, Materials, Diffusion-Controlled Processes
Diffusion in Solids Fundamentals, Methods, Materials, Diffusion-Controlled Processes
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Mehrer, Helmut. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-71488-0
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9. 
Cover image for Physics of Ferroelectrics A Modern Perspective
Physics of Ferroelectrics A Modern Perspective
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Rabe, Karin M. editor. Ahn, Charles H. editor. Triscone, Jean-Marc. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-34591-6
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10. 
Cover image for Low-Dimensional Molecular Metals
Low-Dimensional Molecular Metals
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Toyota, Naoki. author. Müller, Jens. author. Lang, Michael. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-49576-5
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11. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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12. 
Cover image for Pulvermetallurgie Technologien und Werkstoffe
Pulvermetallurgie Technologien und Werkstoffe
Author 
Schatt, Werner. editor. Wieters, Klaus-Peter. editor. Kieback, Bernd. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-68112-0
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