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169. 
Cover image for FPGA Based Accelerators for Financial Applications
FPGA Based Accelerators for Financial Applications
Author 
De Schryver, Christian. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-15407-7
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170. 
Cover image for Multi-Net Optimization of VLSI Interconnect
Multi-Net Optimization of VLSI Interconnect
Author 
Moiseev, Konstantin. author. Kolodny, Avinoam. author. Wimer, Shmuel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-0821-5
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171. 
Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2751-7
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172. 
Cover image for Advanced Hardware Design for Error Correcting Codes
Advanced Hardware Design for Error Correcting Codes
Author 
Chavet, Cyrille. editor. Coussy, Philippe. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-10569-7
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173. 
Cover image for Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
Author 
Reynders, Nele. author. Dehaene, Wim. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-16136-5
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174. 
Cover image for Radio Frequency Integrated Circuit Design for Cognitive Radio Systems
Radio Frequency Integrated Circuit Design for Cognitive Radio Systems
Author 
Fahim, Amr. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-11011-0
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175. 
Cover image for Computing in Research and Development in Africa Benefits, Trends, Challenges and Solutions
Computing in Research and Development in Africa Benefits, Trends, Challenges and Solutions
Author 
Gamatié, Abdoulaye. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08239-4
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176. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-25376-8
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177. 
Cover image for Cyberphysical Systems for Epilepsy and Related Brain Disorders Multi-parametric Monitoring and Analysis for Diagnosis and Optimal Disease Management
Cyberphysical Systems for Epilepsy and Related Brain Disorders Multi-parametric Monitoring and Analysis for Diagnosis and Optimal Disease Management
Author 
Voros, Nikolaos S. editor. Antonopoulos, Christos P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-20049-1
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178. 
Cover image for Debug Automation from Pre-Silicon to Post-Silicon
Debug Automation from Pre-Silicon to Post-Silicon
Author 
Dehbashi, Mehdi. author. Fey, Görschwin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09309-3
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179. 
Cover image for Hot Carrier Degradation in Semiconductor Devices
Hot Carrier Degradation in Semiconductor Devices
Author 
Grasser, Tibor. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08994-2
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180. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-47023-7
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