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13. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331791.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5508-0
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14. 
Cover image for Proceedings of International Conference on VLSI, Communication, Advanced Devices, Signals & Systems and Networking (VCASAN-2013)
Proceedings of International Conference on VLSI, Communication, Advanced Devices, Signals & Systems and Networking (VCASAN-2013)
Author 
Chakravarthi, Veena S. editor. Shirur, Yasha Jyothi M. editor. Prasad, Rekha. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(335522.1)
Electronic Access 
http://dx.doi.org/10.1007/978-81-322-1524-0
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15. 
Cover image for Theory of Digital Automata
Theory of Digital Automata
Author 
Borowik, Bohdan. author. Karpinskyy, Mykola. author. Lahno, Valery. author. Petrov, Oleksandr. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(335923.1)
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-5228-3
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16. 
Cover image for Generating Analog IC Layouts with LAYGEN II
Generating Analog IC Layouts with LAYGEN II
Author 
Martins, Ricardo M. F. author. Lourenço, Nuno C. C. author. Horta, Nuno C. G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333672.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-33146-6
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17. 
Cover image for Variation-Aware Adaptive Voltage Scaling for Digital CMOS Circuits
Variation-Aware Adaptive Voltage Scaling for Digital CMOS Circuits
Author 
Wirnshofer, Martin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(336184.1)
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http://dx.doi.org/10.1007/978-94-007-6196-4
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18. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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19. 
Cover image for Introduction to Biosensors From Electric Circuits to Immunosensors
Introduction to Biosensors From Electric Circuits to Immunosensors
Author 
Yoon, Jeong-Yeol. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330812.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6022-1
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20. 
Cover image for Integrated Optical Interconnect Architectures for Embedded Systems
Integrated Optical Interconnect Architectures for Embedded Systems
Author 
O'Connor, Ian. editor. Nicolescu, Gabriela. editor. SpringerLink (Online service)
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ONLINE(330817.1)
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http://dx.doi.org/10.1007/978-1-4419-6193-8
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21. 
Cover image for Automotive Radar Sensors in Silicon Technologies
Automotive Radar Sensors in Silicon Technologies
Author 
Jain, Vipul. author. Heydari, Payam. author. SpringerLink (Online service)
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ONLINE(330821.1)
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http://dx.doi.org/10.1007/978-1-4419-6775-6
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22. 
Cover image for Electromagnetic Behaviour of Metallic Wire Structures
Electromagnetic Behaviour of Metallic Wire Structures
Author 
Chui, S. T. author. Zhou, Lei. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330920.1)
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http://dx.doi.org/10.1007/978-1-4471-4159-4
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23. 
Cover image for Photovoltaic Sources Modeling and Emulation
Photovoltaic Sources Modeling and Emulation
Author 
Di Piazza, Maria Carmela. author. Vitale, Gianpaolo. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330965.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4378-9
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24. 
Cover image for Embedded Multimedia Security Systems Algorithms and Architectures
Embedded Multimedia Security Systems Algorithms and Architectures
Author 
Pande, Amit. author. Zambreno, Joseph. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330984.1)
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http://dx.doi.org/10.1007/978-1-4471-4459-5
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