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2005
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13. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331791.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5508-0
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14. 
Cover image for 3D Video Coding for Embedded Devices Energy Efficient Algorithms and Architectures
3D Video Coding for Embedded Devices Energy Efficient Algorithms and Architectures
Author 
Zatt, Bruno. author. Shafique, Muhammad. author. Bampi, Sergio. author. Henkel, Jörg. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332110.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-6759-5
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15. 
Cover image for Technological Innovation for the Internet of Things 4th IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2013, Costa de Caparica, Portugal, April 15-17, 2013. Proceedings
Technological Innovation for the Internet of Things 4th IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2013, Costa de Caparica, Portugal, April 15-17, 2013. Proceedings
Author 
Camarinha-Matos, Luis M. editor. Tomic, Slavisa. editor. Graça, Paula. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(334402.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-37291-9
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