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13. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-99-1455-5
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14. 
Cover image for Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Author 
Manetakis, Konstantinos. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-31086-7
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15. 
Cover image for Advances in Signal Processing, Embedded Systems and IoT Proceedings of Seventh ICMEET- 2022
Advances in Signal Processing, Embedded Systems and IoT Proceedings of Seventh ICMEET- 2022
Author 
Chakravarthy, V.V.S.S.S. editor. Bhateja, Vikrant. editor. Flores Fuentes, Wendy. editor. Anguera, Jaume. editor. Vasavi, K. Padma. editor.
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https://doi.org/10.1007/978-981-19-8865-3
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16. 
Cover image for Essential Circuit Analysis Using Proteus®
Essential Circuit Analysis Using Proteus®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-4353-9
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17. 
Cover image for Basic Electronic Circuits Problems and Solutions
Basic Electronic Circuits Problems and Solutions
Author 
Vasudevan, K. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-09363-0
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18. 
Cover image for Selected Sensor Circuits From Data Sheet to Simulation
Selected Sensor Circuits From Data Sheet to Simulation
Author 
Baumann, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-38212-4
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19. 
Cover image for Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Author 
Keller, Reto B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-14186-7
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20. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-12818-9
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21. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
Author 
Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0451-8
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22. 
Cover image for Switched Inductor Power IC Design
Switched Inductor Power IC Design
Author 
Rincón-Mora, Gabriel Alfonso. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-95899-2
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23. 
Cover image for Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Author 
Philippe, Bart. author. Reynaert, Patrick. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-11224-9
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24. 
Cover image for High-Speed System and Analog Input/Output Design
High-Speed System and Analog Input/Output Design
Author 
Tran, Thanh T. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-04954-5
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