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13. 
Cover image for High-Z Materials for X-ray Detection Material Properties and Characterization Techniques
High-Z Materials for X-ray Detection Material Properties and Characterization Techniques
Author 
Abbene, Leonardo. editor. Iniewski, Krzysztof (Kris). editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-20955-0
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14. 
Cover image for Hardware Security Primitives
Hardware Security Primitives
Author 
Tehranipoor, Mark. author. Pundir, Nitin. author. Vashistha, Nidish. author. Farahmandi, Farimah. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-19185-5
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15. 
Cover image for Analog and Mixed-Signal Circuits in Nanoscale CMOS
Analog and Mixed-Signal Circuits in Nanoscale CMOS
Author 
Paulo da Silva Martins, Rui. editor. Mak, Pui-In. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22231-3
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16. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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17. 
Cover image for Advanced X-Ray Radiation Detection: Medical Imaging and Industrial Applications
Advanced X-Ray Radiation Detection: Medical Imaging and Industrial Applications
Author 
Iniewski, Krzysztof (Kris). editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-92989-3
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18. 
Cover image for Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Author 
Harpe, Pieter. editor. Baschirotto, Andrea. editor. Makinwa, Kofi A.A. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-28912-5
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19. 
Cover image for Power-Efficient High-Speed Parallel-Sampling ADCs for Broadband Multi-carrier Systems
Power-Efficient High-Speed Parallel-Sampling ADCs for Broadband Multi-carrier Systems
Author 
Lin, Yu. author. Hegt, Hans. author. Doris, Kostas. author. van Roermund, Arthur H.M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17680-2
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20. 
Cover image for Computational Electromagnetics-Retrospective and Outlook In Honor of Wolfgang J.R. Hoefer
Computational Electromagnetics-Retrospective and Outlook In Honor of Wolfgang J.R. Hoefer
Author 
Ahmed, Iftikhar. editor. Chen, Zhizhang (David). editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-287-095-7
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21. 
Cover image for Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Author 
Maharatna, Koushik. editor. Dalapati, Goutam Kumar. editor. Banerjee, P K. editor. Mallick, Amiya Kumar. editor. Mukherjee, Moumita. editor.
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https://doi.org/10.1007/978-81-322-2274-3
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22. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06773-5
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23. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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24. 
Cover image for High-speed devices and circuits with THz applications
High-speed devices and circuits with THz applications
Author 
Choi, Jung Han, editor. Iniewski, Krzysztof, 1960- editor.
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TK7877 .H54 2015
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