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1. 
Cover image for Topics in Modal Analysis & Parameter Identification, Volume 8 Proceedings of the 40th IMAC, A Conference and Exposition on Structural Dynamics 2022
Topics in Modal Analysis & Parameter Identification, Volume 8 Proceedings of the 40th IMAC, A Conference and Exposition on Structural Dynamics 2022
Author 
Dilworth, Brandon J. editor. Marinone, Timothy. editor. Mains, Michael. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-05445-7
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2. 
Cover image for The MicroRNA Quantum Code Book
The MicroRNA Quantum Code Book
Author 
Fujii, Yoichi Robertus. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-8586-7
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3. 
Cover image for Recent Advances in Structural Engineering and Construction Management Select Proceedings of ICSMC 2021
Recent Advances in Structural Engineering and Construction Management Select Proceedings of ICSMC 2021
Author 
Hau, Kong Kian. editor. Gupta, Ashok Kumar. editor. Chaudhary, Sandeep. editor. Gupta, Tanmay. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-4040-8
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4. 
Cover image for Analysis of Thin-Walled Beams
Analysis of Thin-Walled Beams
Author 
Kim, Yoon Young. author. Jang, Gang-Won. author. Choi, Soomin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-7772-5
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5. 
Cover image for Proceedings of 17th Symposium on Earthquake Engineering (Vol. 1)
Proceedings of 17th Symposium on Earthquake Engineering (Vol. 1)
Author 
Shrikhande, Manish. editor. Agarwal, Pankaj. editor. Kumar, P. C. Ashwin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-1608-5
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6. 
Cover image for 6GN for Future Wireless Networks 5th EAI International Conference, 6GN 2022, Harbin, China, December 17-18, 2022, Proceedings, Part I
6GN for Future Wireless Networks 5th EAI International Conference, 6GN 2022, Harbin, China, December 17-18, 2022, Proceedings, Part I
Author 
Li, Ao. editor. Shi, Yao. editor. Xi, Liang. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-36011-4
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7. 
Cover image for Information Systems 19th European, Mediterranean, and Middle Eastern Conference, EMCIS 2022, Virtual Event, December 21-22, 2022, Proceedings
Information Systems 19th European, Mediterranean, and Middle Eastern Conference, EMCIS 2022, Virtual Event, December 21-22, 2022, Proceedings
Author 
Papadaki, Maria. editor. Rupino da Cunha, Paulo. editor. Themistocleous, Marinos. editor. Christodoulou, Klitos. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-30694-5
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8. 
Cover image for Intelligent Robotics and Applications 16th International Conference, ICIRA 2023, Hangzhou, China, July 5-7, 2023, Proceedings, Part IX
Intelligent Robotics and Applications 16th International Conference, ICIRA 2023, Hangzhou, China, July 5-7, 2023, Proceedings, Part IX
Author 
Yang, Huayong. editor. Liu, Honghai. editor. Zou, Jun. editor. Yin, Zhouping. editor. Liu, Lianqing. editor. (orcid)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-6504-5
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9. 
Cover image for Artificial Intelligence XL 43rd SGAI International Conference on Artificial Intelligence, AI 2023, Cambridge, UK, December 12-14, 2023, Proceedings
Artificial Intelligence XL 43rd SGAI International Conference on Artificial Intelligence, AI 2023, Cambridge, UK, December 12-14, 2023, Proceedings
Author 
Bramer, Max. editor. Stahl, Frederic. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-47994-6
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10. 
Cover image for Handbook of computational sciences : a multi and interdisciplinary approach
Handbook of computational sciences : a multi and interdisciplinary approach
Author 
Elngar, Ahmed A., editor.
Preferred Shelf Number 
QA76 .H36 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119763468
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11. 
Cover image for Miniaturized analytical devices : materials and technology
Miniaturized analytical devices : materials and technology
Author 
Kailasa, Suresh Kumar, editor. Hussain, Chaudhery Mustansar, editor.
Preferred Shelf Number 
QD75.22
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527827213
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12. 
Cover image for Light weight materials : processing and characterization
Light weight materials : processing and characterization
Author 
Kumar, K. (Kaushik), 1968- editor. Babu, B. Sridhar, editor. Davim, J. Paulo, editor.
Preferred Shelf Number 
TA418.9 .L53
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119887669
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