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13. 
Cover image for Systems-Level Packaging for Millimeter-Wave Transceivers
Systems-Level Packaging for Millimeter-Wave Transceivers
Author 
Božanić, Mladen. author. (orcid)0000-0001-9174-0781 Sinha, Saurabh. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-030-14690-0
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14. 
Cover image for Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author 
Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0040-1
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15. 
Cover image for Advances in Graphic Communication, Printing and Packaging Proceedings of 2018 9th China Academic Conference on Printing and Packaging
Advances in Graphic Communication, Printing and Packaging Proceedings of 2018 9th China Academic Conference on Printing and Packaging
Author 
Zhao, Pengfei. editor. Ouyang, Yun. editor. Xu, Min. editor. Yang, Li. editor. Ren, Yuhui. editor.
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Electronic Access 
https://doi.org/10.1007/978-981-13-3663-8
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16. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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17. 
Cover image for Applied Sciences in Graphic Communication and Packaging Proceedings of 2017 49th Conference of the International Circle of Educational Institutes for Graphic Arts Technology and Management & 8th China Academic Conference on Printing and Packaging
Applied Sciences in Graphic Communication and Packaging Proceedings of 2017 49th Conference of the International Circle of Educational Institutes for Graphic Arts Technology and Management & 8th China Academic Conference on Printing and Packaging
Author 
Zhao, Pengfei. editor. Ouyang, Yun. editor. Xu, Min. editor. Yang, Li. editor. Ren, Yuhui. editor.
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https://doi.org/10.1007/978-981-10-7629-9
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18. 
Cover image for Toxicants in Food Packaging and Household Plastics Exposure and Health Risks to Consumers
Toxicants in Food Packaging and Household Plastics Exposure and Health Risks to Consumers
Author 
Snedeker, Suzanne M. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4471-6500-2
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19. 
Cover image for A Real-Time In-Memory Discovery Service Leveraging Hierarchical Packaging Information in a Unique Identifier Network to Retrieve Track and Trace Information
A Real-Time In-Memory Discovery Service Leveraging Hierarchical Packaging Information in a Unique Identifier Network to Retrieve Track and Trace Information
Author 
Müller, Jürgen. author. SpringerLink (Online service)
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ONLINE(334366.1)
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http://dx.doi.org/10.1007/978-3-642-37128-8
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20. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1053-9
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21. 
Cover image for Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Author 
Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-28522-6
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22. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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23. 
Cover image for Food packaging Materiali, tecnologie e qualità degli alimenti
Food packaging Materiali, tecnologie e qualità degli alimenti
Author 
Piergiovanni, Luciano. author. Limbo, Sara. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-88-470-1457-2
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24. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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