Limit Search Results
Author
SpringerLink (Online service)
(15)
Ludwig, John D.
(3)
Nema, Sandeep.
(3)
Caro, Jaime. editor.
(2)
Kabassi, Katerina. editor.
(2)
Language
Publication Date
-
Subject
Electronics.
(4)
Microelectromechanical systems.
(4)
Artificial intelligence.
(3)
Computational intelligence.
(3)
Electronic Circuits and Systems.
(3)
Material Type
Shelf Location
Switch to list view
Switch to thumbnail view
Select an Action
55 Results Found Subscribe to search results
000000000000DEFAULT
Print
13. 
Cover image for Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 2
Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 2
Author 
Kabassi, Katerina. editor. Mylonas, Phivos. editor. Caro, Jaime. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-44146-2
Format: 
Availability 
Online Library~1
Available:
Copies:
14. 
Cover image for Progress in Sustainable Manufacturing
Progress in Sustainable Manufacturing
Author 
Kandasamy, Jayakrishna. editor. Sakthivel, Aravind Raj. editor. Davim, J. Paulo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0201-9
Format: 
Availability 
Online Library~1
Available:
Copies:
15. 
Cover image for Industry 4.0: The Power of Data Selected Papers from the 15th International Conference on Industrial Engineering and Industrial Management
Industry 4.0: The Power of Data Selected Papers from the 15th International Conference on Industrial Engineering and Industrial Management
Author 
Izquierdo, Luis R. editor. Santos, José Ignacio. editor. Lavios, Juan José. editor. Ahedo, Virginia. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-29382-5
Format: 
Availability 
Online Library~1
Available:
Copies:
16. 
Cover image for Handbook of Neuroengineering
Handbook of Neuroengineering
Author 
Thakor, Nitish V. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-16-5540-1
Format: 
Availability 
Online Library~1
Available:
Copies:
17. 
Cover image for Proceedings of 2nd International Conference on Artificial Intelligence, Robotics, and Communication ICAIRC 2022
Proceedings of 2nd International Conference on Artificial Intelligence, Robotics, and Communication ICAIRC 2022
Author 
Yadav, Sanjay. editor. Kumar, Harish. editor. Kankar, Pavan Kumar. editor. Dai, Wanyang. editor. Huang, Fenghua. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-4554-2
Format: 
Availability 
Online Library~1
Available:
Copies:
18. 
Cover image for Application of nano/microencapsulated ingredients in food products
Application of nano/microencapsulated ingredients in food products
Author 
Jafari, Seid Mahdi.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780128157268
Format: 
Availability 
Online Library~1
Available:
Copies:
19. 
Cover image for Electronic Packaging Materials and Their Properties
Electronic Packaging Materials and Their Properties
Author 
Pecht, Michael, author. Agarwal, Rakish, author. Dishongh, Terrance J., author. Javadpour, Sirus, author. Mahajan, Rahul, author.
Preferred Shelf Number 
TK7870.15 P434 2017
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies:
20. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
Format: 
Availability 
Online Library~1
Available:
Copies:
21. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
Format: 
Availability 
Online Library~1
Available:
Copies:
22. 
Cover image for Lyophilized Biologics and Vaccines Modality-Based Approaches
Lyophilized Biologics and Vaccines Modality-Based Approaches
Author 
Varshney, Dushyant. editor. Singh, Manmohan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2383-0
Format: 
Availability 
Online Library~1
Available:
Copies:
23. 
Cover image for Industrial Engineering, Management Science and Applications 2015
Industrial Engineering, Management Science and Applications 2015
Author 
Gen, Mitsuo. editor. Kim, Kuinam J. editor. Huang, Xiaoxia. editor. Hiroshi, Yabe. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-47200-2
Format: 
Availability 
Online Library~1
Available:
Copies:
24. 
Cover image for Extreme environment electronics
Extreme environment electronics
Author 
Cressler, John D. Mantooth, H. Alan, 1963-
Preferred Shelf Number 
TK7870.24 .E97 2013
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies:
Select an Action