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13. 
Cover image for Mapping Innovation The Discipline of Building Opportunity across Value Chains
Mapping Innovation The Discipline of Building Opportunity across Value Chains
Author 
Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-93627-3
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14. 
Cover image for Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Author 
Banerjee, Amal. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-08778-3
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15. 
Cover image for Essential Circuit Analysis using LTspice®
Essential Circuit Analysis using LTspice®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-09853-6
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16. 
Cover image for Essential Circuit Analysis Using Proteus®
Essential Circuit Analysis Using Proteus®
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Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-4353-9
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17. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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18. 
Cover image for Network of Things Engineering (NoTE) Lab
Network of Things Engineering (NoTE) Lab
Author 
Jukan, Admela. author. Masip-Bruin, Xavi. author. Dizdarević, Jasenka. author. Carpio, Francisco. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20635-1
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19. 
Cover image for Cloud Computing with Security and Scalability. Concepts and Practices
Cloud Computing with Security and Scalability. Concepts and Practices
Author 
Sehgal, Naresh Kumar. author. Bhatt, Pramod Chandra P. author. Acken, John M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-07242-0
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20. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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21. 
Cover image for Applications in Electronics Pervading Industry, Environment and Society APPLEPIES 2022
Applications in Electronics Pervading Industry, Environment and Society APPLEPIES 2022
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Berta, Riccardo. editor. De Gloria, Alessandro. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30333-3
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22. 
Cover image for Selected Sensor Circuits From Data Sheet to Simulation
Selected Sensor Circuits From Data Sheet to Simulation
Author 
Baumann, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-38212-4
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23. 
Cover image for Logic Locking A Practical Approach to Secure Hardware
Logic Locking A Practical Approach to Secure Hardware
Author 
Sisejkovic, Dominik. author. Leupers, Rainer. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-19123-7
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24. 
Cover image for Ultra-low Voltage Circuit Techniques for Energy Harvesting
Ultra-low Voltage Circuit Techniques for Energy Harvesting
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Radin, Rafael Luciano. author. Machado, Marcio Bender. author. Sawan, Mohamad. author. Galup-Montoro, Carlos. author. Schneider, Marcio Cherem. author.
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https://doi.org/10.1007/978-3-031-04492-2
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