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13. 
Cover image for High-level Estimation and Exploration of Reliability for Multi-Processor System-on-Chip
High-level Estimation and Exploration of Reliability for Multi-Processor System-on-Chip
Author 
Wang, Zheng. author. Chattopadhyay, Anupam. author. (orcid)0000-0002-8818-6983 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-1073-6
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14. 
Cover image for Advances in Human Error, Reliability, Resilience, and Performance Proceedings of the AHFE 2017 International Conference on Human Error, Reliability, Resilience, and Performance, July 17–21,2017, The Westin Bonaventure Hotel,Los Angeles, California, USA
Advances in Human Error, Reliability, Resilience, and Performance Proceedings of the AHFE 2017 International Conference on Human Error, Reliability, Resilience, and Performance, July 17–21,2017, The Westin Bonaventure Hotel,Los Angeles, California, USA
Author 
Boring, Ronald Laurids. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-60645-3
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15. 
Cover image for Reliability and Statistics in Transportation and Communication Selected Papers from the 17th International Conference on Reliability and Statistics in Transportation and Communication, RelStat’17, 18-21 October, 2017, Riga, Latvia
Reliability and Statistics in Transportation and Communication Selected Papers from the 17th International Conference on Reliability and Statistics in Transportation and Communication, RelStat’17, 18-21 October, 2017, Riga, Latvia
Author 
Kabashkin, Igor. editor. Yatskiv, Irina. editor. Prentkovskis, Olegas. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-74454-4
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16. 
Cover image for Solid State Lighting Reliability Part 2 Components to Systems
Solid State Lighting Reliability Part 2 Components to Systems
Author 
van Driel, Willem Dirk. editor. Fan, Xuejun. editor. Zhang, Guo Qi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-58175-0
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17. 
Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Author 
Suganuma, Katsuaki, editor.
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ScienceDirect https://www.sciencedirect.com/science/book/9780081020944
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18. 
Cover image for Risk-Based Engineering An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants
Risk-Based Engineering An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants
Author 
Varde, Prabhakar V. author. Pecht, Michael G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-0090-5
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19. 
Cover image for Advanced Maintenance Policies for Shock and Damage Models
Advanced Maintenance Policies for Shock and Damage Models
Author 
Zhao, Xufeng. author. Nakagawa, Toshio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-70456-2
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20. 
Cover image for Critical Infrastructures, Key Resources, Key Assets Risk, Vulnerability, Resilience, Fragility, and Perception Governance
Critical Infrastructures, Key Resources, Key Assets Risk, Vulnerability, Resilience, Fragility, and Perception Governance
Author 
Gheorghe, Adrian V. author. Vamanu, Dan V. author. Katina, Polinpapilinho F. author. Pulfer, Roland. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-69224-1
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21. 
Cover image for Infrastructure health in civil engineering
Infrastructure health in civil engineering
Author 
Ettouney, Mohammed. Alampalli, Sreenivas.
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Distributed by publisher. Purchase or institutional license may be required for access.
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