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2023
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13. 
Cover image for Arbitrary Modeling of TSVs for 3D Integrated Circuits
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author 
Salah, Khaled. author. Ismail, Yehea. author. El-Rouby, Alaa. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-07611-9
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14. 
Cover image for More than Moore Technologies for Next Generation Computer Design
More than Moore Technologies for Next Generation Computer Design
Author 
Topaloglu, Rasit O. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2163-8
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15. 
Cover image for FPGA Design Best Practices for Team-based Reuse
FPGA Design Best Practices for Team-based Reuse
Author 
Simpson, Philip Andrew. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-17924-7
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16. 
Cover image for Engineering Embedded Systems Physics, Programs, Circuits
Engineering Embedded Systems Physics, Programs, Circuits
Author 
Hintenaus, Peter. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-10680-9
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17. 
Cover image for Multiprocessor Scheduling for Real-Time Systems
Multiprocessor Scheduling for Real-Time Systems
Author 
Baruah, Sanjoy. author. Bertogna, Marko. author. Buttazzo, Giorgio. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-08696-5
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18. 
Cover image for Wideband CMOS Receivers
Wideband CMOS Receivers
Author 
Fernandes, Miguel D. editor. Oliveira, Luis B. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-18920-8
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