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13. 
Cover image for Method of Dimensionality Reduction in Contact Mechanics and Friction
Method of Dimensionality Reduction in Contact Mechanics and Friction
Author 
Popov, Valentin L. author. Heß, Markus. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-53876-6
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14. 
Cover image for Design engineer's reference guide : mathematics, mechanics, and thermodynamics
Design engineer's reference guide : mathematics, mechanics, and thermodynamics
Author 
Richards, Keith L., author.
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15. 
Cover image for Toward Structural Mechanics Through Wooden Bridges in France (1716-1841)
Toward Structural Mechanics Through Wooden Bridges in France (1716-1841)
Author 
Tardini, Chiara. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-00287-3
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16. 
Cover image for Optimization Methods From Theory to Design Scientific and Technological Aspects in Mechanics
Optimization Methods From Theory to Design Scientific and Technological Aspects in Mechanics
Author 
Cavazzuti, Marco. author. SpringerLink (Online service)
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ONLINE(333405.1)
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http://dx.doi.org/10.1007/978-3-642-31187-1
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17. 
Cover image for Engineering mechanics and design applications transdisciplinary engineering fundamentals
Engineering mechanics and design applications transdisciplinary engineering fundamentals
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Ertas, Atila, 1944-
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18. 
Cover image for Damage Mechanics and Micromechanics of Localized Fracture Phenomena in Inelastic Solids
Damage Mechanics and Micromechanics of Localized Fracture Phenomena in Inelastic Solids
Author 
Voyiadjis, George Z. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-7091-0427-9
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19. 
Cover image for Damage and Fracture Mechanics Failure Analysis of Engineering Materials and Structures
Damage and Fracture Mechanics Failure Analysis of Engineering Materials and Structures
Author 
Boukharouba, Taoufik. editor. Elboujdaini, Mimoun. editor. Pluvinage, Guy. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-2669-9
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20. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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21. 
Cover image for III European Conference on Computational Mechanics Solids, Structures and Coupled Problems in Engineering: Book of Abstracts
III European Conference on Computational Mechanics Solids, Structures and Coupled Problems in Engineering: Book of Abstracts
Author 
Motasoares, C. A. editor. Martins, J. A. C. editor. Rodrigues, H. C. editor. Ambrósio, Jorge A. C. editor. Pina, C. A. B. editor.
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http://dx.doi.org/10.1007/1-4020-5370-3
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22. 
Cover image for A Two-Dimensional Piezoresistivity Model for Anisotropic Materials and its Application in Self-Sensing of Carbon Fiber Reinforced Plastics
A Two-Dimensional Piezoresistivity Model for Anisotropic Materials and its Application in Self-Sensing of Carbon Fiber Reinforced Plastics
Author 
Scholle, Patrick. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-23766-9
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23. 
Cover image for Analysis of Thin-Walled Beams
Analysis of Thin-Walled Beams
Author 
Kim, Yoon Young. author. Jang, Gang-Won. author. Choi, Soomin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-7772-5
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24. 
Cover image for Plasticity-Damage Couplings: From Single Crystal to Polycrystalline Materials
Plasticity-Damage Couplings: From Single Crystal to Polycrystalline Materials
Author 
Cazacu, Oana. author. Revil-Baudard, Benoit. author. Chandola, Nitin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-92922-4
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