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13. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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14. 
Cover image for 3D and circuit integration of MEMS
3D and circuit integration of MEMS
Author 
Esashi, Masayoshi, 1949- author.
Preferred Shelf Number 
TK7875 .E73 2021 EB
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527823239
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15. 
Cover image for Self Assembly: The Science of Things That Put Themselves Together.
Self Assembly: The Science of Things That Put Themselves Together.
Author 
Pelesko, John A., author.
Preferred Shelf Number 
TA418.9 .N35
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/e/9781584886884
Taylor & Francis https://www.taylorfrancis.com/books/e/9780429143328
Taylor & Francis https://www.taylorfrancis.com/books/9780429143328
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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16. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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17. 
Cover image for Advances in Neuromorphic Hardware Exploiting Emerging Nanoscale Devices
Advances in Neuromorphic Hardware Exploiting Emerging Nanoscale Devices
Author 
Suri, Manan. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-3703-7
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18. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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19. 
Cover image for Outlook and Challenges of Nano Devices, Sensors, and MEMS
Outlook and Challenges of Nano Devices, Sensors, and MEMS
Author 
Li, Ting. editor. Liu, Ziv. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-50824-5
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20. 
Cover image for Nanovate Commercializing Disruptive Nanotechnologies
Nanovate Commercializing Disruptive Nanotechnologies
Author 
Anis, Mohab. author. AlTaher, Ghada. author. Sarhan, Wesam. author. Elsemary, Mona. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44863-3
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21. 
Cover image for Next Generation Spin Torque Memories
Next Generation Spin Torque Memories
Author 
Kaushik, Brajesh Kumar. author. Verma, Shivam. author. Kulkarni, Anant Aravind. author. Prajapati, Sanjay. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-2720-8
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22. 
Cover image for Nanofabrication Principles, Capabilities and Limits
Nanofabrication Principles, Capabilities and Limits
Author 
Cui, Zheng. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-39361-2
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23. 
Cover image for Frontiers in Electronic Technologies Trends and Challenges
Frontiers in Electronic Technologies Trends and Challenges
Author 
Prabaharan, S.R.S. editor. Thalmann, Nadia Magnenat. editor. (orcid)0000-0002-1459-5960 Kanchana Bhaaskaran, V. S. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-4235-5
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24. 
Cover image for Nonsmooth Mechanics Models, Dynamics and Control
Nonsmooth Mechanics Models, Dynamics and Control
Author 
Brogliato, Bernard. author. (orcid)0000-0002-6193-9404 SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-28664-8
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