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1. 
Cover image for Advances in Intelligent Manufacturing and Robotics Selected Articles from ICIMR 2023; 22-23 August, Suzhou, China
Advances in Intelligent Manufacturing and Robotics Selected Articles from ICIMR 2023; 22-23 August, Suzhou, China
Author 
Tan, Andrew. editor. Zhu, Fan. editor. (orcid)0009-0004-2734-6842 Jiang, Haochuan. editor. Mostafa, Kazi. editor. Yap, Eng Hwa. editor.
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https://doi.org/10.1007/978-981-99-8498-5
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2. 
Cover image for Molecular Communications An Analysis from Networking Theories Perspective
Molecular Communications An Analysis from Networking Theories Perspective
Author 
Cevallos, Yesenia. author. Vacacela Gómez, Cristian. author. Tello-Oquendo, Luis. author. (orcid)0000-0002-5274-666X Tene, Talia. author. Inca, Deysi. author.
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https://doi.org/10.1007/978-3-031-36882-0
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3. 
Cover image for Intelligent Manufacturing and Mechatronics Selected Articles from iM3F 2023, 07-08 August, Pekan, Malaysia
Intelligent Manufacturing and Mechatronics Selected Articles from iM3F 2023, 07-08 August, Pekan, Malaysia
Author 
Mohd. Isa, Wan Hasbullah. editor. Khairuddin, Ismail Mohd. editor. Mohd. Razman, Mohd. Azraai. editor. Saruchi, Sarah 'Atifah. editor. Teh, Sze-Hong. editor.
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https://doi.org/10.1007/978-981-99-8819-8
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4. 
Cover image for Nanofabrication Principles, Capabilities and Limits
Nanofabrication Principles, Capabilities and Limits
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Cui, Zheng. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-62546-6
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5. 
Cover image for Fundamentals of Mechanisms and Machines
Fundamentals of Mechanisms and Machines
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Manik, Dhanesh N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-1810-8
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6. 
Cover image for MEMS and Microfluidics in Healthcare Devices and Applications Perspectives
MEMS and Microfluidics in Healthcare Devices and Applications Perspectives
Author 
Guha, Koushik. editor. Dutta, Gorachand. editor. (orcid)0000-0003-2980-9826 Biswas, Arindam. editor. Srinivasa Rao, K. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-8714-4
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7. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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8. 
Cover image for Microactuators, Microsensors and Micromechanisms MAMM 2022
Microactuators, Microsensors and Micromechanisms MAMM 2022
Author 
Pandey, Ashok Kumar. editor. Pal, Prem. editor. Nagahanumaiah. editor. Zentner, Lena. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20353-4
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9. 
Cover image for Advances in Intelligent Manufacturing and Mechatronics Selected Articles from the Innovative Manufacturing, Mechatronics & Materials Forum (iM3F 2022), Pahang, Malaysia
Advances in Intelligent Manufacturing and Mechatronics Selected Articles from the Innovative Manufacturing, Mechatronics & Materials Forum (iM3F 2022), Pahang, Malaysia
Author 
Abdullah, Muhammad Amirul. editor. Khairuddin, Ismail Mohd. editor. Ab. Nasir, Ahmad Fakhri. editor. Mohd. Isa, Wan Hasbullah. editor. Mohd. Razman, Mohd. Azraai. editor.
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https://doi.org/10.1007/978-981-19-8703-8
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10. 
Cover image for Fundamentals of Nanomechanical Resonators
Fundamentals of Nanomechanical Resonators
Author 
Schmid, Silvan. author. Villanueva, Luis Guillermo. author. Roukes, Michael Lee. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29628-4
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11. 
Cover image for Metasurfaces: Towards Tunable and Reconfigurable Meta-devices
Metasurfaces: Towards Tunable and Reconfigurable Meta-devices
Author 
Zhu, Weiming. author. Liu, Ai-Qun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-6925-6
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12. 
Cover image for Nanomedicine
Nanomedicine
Author 
Gu, Ning. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-16-8984-0
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