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13. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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14. 
Cover image for Advances in Neuromorphic Hardware Exploiting Emerging Nanoscale Devices
Advances in Neuromorphic Hardware Exploiting Emerging Nanoscale Devices
Author 
Suri, Manan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-3703-7
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15. 
Cover image for Outlook and Challenges of Nano Devices, Sensors, and MEMS
Outlook and Challenges of Nano Devices, Sensors, and MEMS
Author 
Li, Ting. editor. Liu, Ziv. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-50824-5
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16. 
Cover image for Next Generation Spin Torque Memories
Next Generation Spin Torque Memories
Author 
Kaushik, Brajesh Kumar. author. Verma, Shivam. author. Kulkarni, Anant Aravind. author. Prajapati, Sanjay. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-2720-8
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17. 
Cover image for Memristor-Based Nanoelectronic Computing Circuits and Architectures Foreword by Leon Chua
Memristor-Based Nanoelectronic Computing Circuits and Architectures Foreword by Leon Chua
Author 
Vourkas, Ioannis. author. Sirakoulis, Georgios Ch. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-22647-7
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18. 
Cover image for Crosstalk in Modern On-Chip Interconnects A FDTD Approach
Crosstalk in Modern On-Chip Interconnects A FDTD Approach
Author 
Kaushik, B.K. author. Kumar, V. Ramesh. author. Patnaik, Amalendu. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-10-0800-9
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19. 
Cover image for Carbon Nanotube Based VLSI Interconnects Analysis and Design
Carbon Nanotube Based VLSI Interconnects Analysis and Design
Author 
Kaushik, Brajesh Kumar. author. Majumder, Manoj Kumar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2047-3
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20. 
Cover image for Flip-Flop Design in Nanometer CMOS From High Speed to Low Energy
Flip-Flop Design in Nanometer CMOS From High Speed to Low Energy
Author 
Alioto, Massimo. author. Consoli, Elio. author. Palumbo, Gaetano. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-01997-0
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21. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2128-7
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22. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-47023-7
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23. 
Cover image for Resonant Tunneling Quantum Waveguides of Variable Cross-Section, Asymptotics, Numerics, and Applications
Resonant Tunneling Quantum Waveguides of Variable Cross-Section, Asymptotics, Numerics, and Applications
Author 
Baskin, Lev. author. Neittaanmäki, Pekka. author. Plamenevskii, Boris. author. Sarafanov, Oleg. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-15105-2
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24. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-25376-8
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