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1. 
Cover image for Bonding in Microsystem Technology
Bonding in Microsystem Technology
Author 
Dziuban, Jan A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4589-1
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Cover image for Continuous-Time Sigma-Delta A/D Conversion Fundamentals, Performance Limits and Robust Implementations
Continuous-Time Sigma-Delta A/D Conversion Fundamentals, Performance Limits and Robust Implementations
Author 
Ortmanns, Maurits. author. Gerfers, Friedel. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/3-540-28473-7
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3. 
Cover image for High Dielectric Constant Materials VLSI MOSFET Applications
High Dielectric Constant Materials VLSI MOSFET Applications
Author 
Huff, H.R. editor. Gilmer, D.C. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137574
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4. 
Cover image for Gettering Defects in Semiconductors
Gettering Defects in Semiconductors
Author 
Perevoschikov, Victor A. author. Skoupov, Vladimir D. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/3-540-29499-6
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5. 
Cover image for Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Author 
Valle, Maurizio. editor. (orcid)0000-0002-7366-6060 Gastaldo, Paolo. editor. (orcid)0000-0002-5748-3942 Limiti, Ernesto. editor. (orcid)0000-0003-4668-7461 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-71518-1
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6. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3627-0
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7. 
Cover image for Printed Flexible Sensors Fabrication, Characterization and Implementation
Printed Flexible Sensors Fabrication, Characterization and Implementation
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Nag, Anindya. author. Mukhopadhyay, Subhas Chandra. author. Kosel, Jurgen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-13765-6
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8. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-75708-7
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9. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
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Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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10. 
Cover image for Power GaN Devices Materials, Applications and Reliability
Power GaN Devices Materials, Applications and Reliability
Author 
Meneghini, Matteo. editor. Meneghesso, Gaudenzio. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-43199-4
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11. 
Cover image for Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Author 
Askerzade, Iman. author. Bozbey, Ali. author. Cantürk, Mehmet. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-48433-4
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12. 
Cover image for Fracture Mechanics of Piezoelectric Solids with Interface Cracks
Fracture Mechanics of Piezoelectric Solids with Interface Cracks
Author 
Govorukha, Volodymyr. author. Kamlah, Marc. author. Loboda, Volodymyr. author. Lapusta, Yuri. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-53553-1
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