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13. 
Cover image for Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Author 
Laconte, J. author. Flandre, D. author. Raskin, J. -P. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-28843-0
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14. 
Cover image for Low Power VCO Design in CMOS
Low Power VCO Design in CMOS
Author 
Tiebout, Marc. author. Itoh, Kiyoo. editor. Lee, Thomas. editor. Sakurai, Takayasu. editor. Sansen, Willy M. C. editor.
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Electronic Access 
http://dx.doi.org/10.1007/3-540-29256-X
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15. 
Cover image for The Physics of Semiconductors An Introduction Including Devices and Nanophysics
The Physics of Semiconductors An Introduction Including Devices and Nanophysics
Author 
Grundmann, Marius. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/3-540-34661-9
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16. 
Cover image for Microscopy of Semiconducting Materials Proceedings of the 14th Conference, April 11–14, 2005, Oxford, UK
Microscopy of Semiconducting Materials Proceedings of the 14th Conference, April 11–14, 2005, Oxford, UK
Author 
Cullis, A. G. editor. Hutchison, J. L. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/3-540-31915-8
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17. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/1-84628-235-7
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