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13. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331791.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5508-0
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14. 
Cover image for Integrated Optical Interconnect Architectures for Embedded Systems
Integrated Optical Interconnect Architectures for Embedded Systems
Author 
O'Connor, Ian. editor. Nicolescu, Gabriela. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330817.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6193-8
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15. 
Cover image for Intelligent integrated systems : devices, technologies, and architectures
Intelligent integrated systems : devices, technologies, and architectures
Author 
Deleonibus, Simon, editor.
Preferred Shelf Number 
TS155.63 .I58 2013
Electronic Access 
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16. 
Cover image for Integrated Frequency Synthesis for Convergent Wireless Solutions
Integrated Frequency Synthesis for Convergent Wireless Solutions
Author 
Atallah, Jad G. author. Ismail, Mohammed. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1466-7
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17. 
Cover image for Process Variations and Probabilistic Integrated Circuit Design
Process Variations and Probabilistic Integrated Circuit Design
Author 
Dietrich, Manfred. editor. Haase, Joachim. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6621-6
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18. 
Cover image for Integrated 60GHz RF Beamforming in CMOS
Integrated 60GHz RF Beamforming in CMOS
Author 
Yu, Yikun. author. Baltus, Peter G.M. author. van Roermund, Arthur H.M. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-0662-0
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19. 
Cover image for High-Frequency Oscillator Design for Integrated Transceivers
High-Frequency Oscillator Design for Integrated Transceivers
Author 
Tang, Johan. author. Kasperkovitz, Dieter. author. Roermund, Arthur. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/b106010
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20. 
Cover image for Parasitic Substrate Coupling in High Voltage Integrated Circuits Minority and Majority Carriers Propagation in Semiconductor Substrate
Parasitic Substrate Coupling in High Voltage Integrated Circuits Minority and Majority Carriers Propagation in Semiconductor Substrate
Author 
Buccella, Pietro. author. Stefanucci, Camillo. author. Kayal, Maher. author. Sallese, Jean-Michel. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-74382-0
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21. 
Cover image for Radiation Hardened CMOS Integrated Circuits for Time-Based Signal Processing
Radiation Hardened CMOS Integrated Circuits for Time-Based Signal Processing
Author 
Prinzie, Jeffrey. author. Steyaert, Michiel. author. Leroux, Paul. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-78616-2
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22. 
Cover image for CMOS Integrated Circuit Design for Wireless Power Transfer
CMOS Integrated Circuit Design for Wireless Power Transfer
Author 
Lu, Yan. author. Ki, Wing-Hung. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-10-2615-7
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23. 
Cover image for High-Resolution and High-Speed Integrated CMOS AD Converters for Low-Power Applications
High-Resolution and High-Speed Integrated CMOS AD Converters for Low-Power Applications
Author 
Li, Weitao. author. Li, Fule. author. Wang, Zhihua. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-62012-1
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24. 
Cover image for Cyber-physical systems : integrated computing and engineering design
Cyber-physical systems : integrated computing and engineering design
Author 
Hu, Fei, 1972, author.
Preferred Shelf Number 
TJ213 .H698 2014
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