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13. 
Cover image for Adaptation under Stressful Environments through Biological Adjustments and Interventions
Adaptation under Stressful Environments through Biological Adjustments and Interventions
Author 
Tulsawani, Rajkumar. editor. Vohora, Divya. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(522177.1)
Electronic Access 
https://doi.org/10.1007/978-981-99-7652-2
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14. 
Cover image for Intelligent Data Engineering and Automated Learning - IDEAL 2023 24th International Conference, Évora, Portugal, November 22-24, 2023, Proceedings
Intelligent Data Engineering and Automated Learning - IDEAL 2023 24th International Conference, Évora, Portugal, November 22-24, 2023, Proceedings
Author 
Quaresma, Paulo. editor. Camacho, David. editor. (orcid) Yin, Hujun. editor. (orcid) Gonçalves, Teresa. editor. Julian, Vicente. editor.
Preferred Shelf Number 
XX(521330.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-48232-8
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15. 
Cover image for ASM handbook. Volume 4A, Steel heat treating, fundamentals and processes
ASM handbook. Volume 4A, Steel heat treating, fundamentals and processes
Author 
Dossett, Jon L., editor. Totten, George E., editor. ASM Handbook Committee, editor. ASM International, issuing body. ASM Heat Treating Society, issuing body.
Preferred Shelf Number 
ONLINE(313062.1)
Electronic Access 
Knovel http://app.knovel.com/web/toc.v/cid:kpASMHVAS3
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16. 
Cover image for Fullerene nano-whiskers
Fullerene nano-whiskers
Author 
Miyazawa, Kun'ichi.
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ONLINE
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17. 
Cover image for Thermo-hydro-mechanical processing of wood
Thermo-hydro-mechanical processing of wood
Author 
Navi, Parviz. Sandberg, Dick.
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18. 
Cover image for Innovations in materials manufacturing, fabrication, and environmental safety
Innovations in materials manufacturing, fabrication, and environmental safety
Author 
Schwartz, Mel M.
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19. 
Cover image for Oxide scale behavior in high temperature metal processing
Oxide scale behavior in high temperature metal processing
Author 
Kryzanowski, Michal. Beynon, J. H. (John Herbert) Farrugia, Didier C. J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=530452
John Wiley http://dx.doi.org/10.1002/9783527630318
http://site.ebrary.com/lib/alltitles/Doc?id=10383595
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20. 
Cover image for Conjugate problems in convective heat transfer
Conjugate problems in convective heat transfer
Author 
Dorfman, A. Sh. (Abram Shlemovich)
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21. 
Cover image for Special topics on materials science and technology an Italian panorama
Special topics on materials science and technology an Italian panorama
Author 
Associazione Italiana di Ingegneria dei Materiali. Convegno nazionale (9th : 2008 : Piano di Sorrento, Italy) Acierno, D.
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22. 
Cover image for Handbook of thermal process modeling of steels
Handbook of thermal process modeling of steels
Author 
G¿r, Cemil Hakan. Pan, Jiansheng.
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23. 
Cover image for SIMOX
SIMOX
Author 
Anc, Maria J., ed.
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ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP004E
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24. 
Cover image for Rapid thermal processing for future semiconductor devices proceedings of the 2001 International Conference on Rapid Thermal Processing for Future Semiconductor Devices (RTP 2001), held at Ise-Shima, Mie, Japan, November 14-16, 2001
Rapid thermal processing for future semiconductor devices proceedings of the 2001 International Conference on Rapid Thermal Processing for Future Semiconductor Devices (RTP 2001), held at Ise-Shima, Mie, Japan, November 14-16, 2001
Author 
International Conference on Rapid Thermal Processing for Future Semiconductor Devices (2nd : 2001 : Ise-Shima, Mie, Japan) Fukuda, Hisashi.
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ScienceDirect http://www.sciencedirect.com/science/book/9780444513397
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