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13. 
Cover image for Design of 3D integrated circuits and systems
Design of 3D integrated circuits and systems
Author 
Sharma, Rohit, editor.
Preferred Shelf Number 
TK7874.893 .D48 2014
Electronic Access 
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14. 
Cover image for Ultra-Low Power Integrated Circuit Design Circuits, Systems, and Applications
Ultra-Low Power Integrated Circuit Design Circuits, Systems, and Applications
Author 
Tan, Nianxiong Nick. editor. Li, Dongmei. editor. Wang, Zhihua. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4419-9973-3
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15. 
Cover image for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author 
Lim, Sung Kyu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330852.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9542-1
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16. 
Cover image for Variation-Aware Design of Custom Integrated Circuits: A Hands-on Field Guide A Hands-on Field Guide
Variation-Aware Design of Custom Integrated Circuits: A Hands-on Field Guide A Hands-on Field Guide
Author 
McConaghy, Trent. author. Breen, Kristopher. author. Dyck, Jeffrey. author. Gupta, Amit. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331305.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-2269-3
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17. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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18. 
Cover image for Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping.
Preferred Shelf Number 
TK7874.893 L53 2012
Format: 
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19. 
Cover image for CMOS analog integrated circuits : high-speed and power-efficient design
CMOS analog integrated circuits : high-speed and power-efficient design
Author 
Ndjountche, Tertulien., author.
Preferred Shelf Number 
TK7874 .N35 2011
Electronic Access 
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20. 
Cover image for RF MEMS Switches and Integrated Switching Circuits Design, Fabrication, and Test
RF MEMS Switches and Integrated Switching Circuits Design, Fabrication, and Test
Author 
Liu, Ai-Qun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-46262-2
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21. 
Cover image for Analog Integrated Circuits for Communication Principles, Simulation and Design
Analog Integrated Circuits for Communication Principles, Simulation and Design
Author 
Pederson, Donald O. author. Mayaram, Kartikeya. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-68030-9
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22. 
Cover image for Digital integrated circuits : design-for-test using Simulink and Stateflow
Digital integrated circuits : design-for-test using Simulink and Stateflow
Author 
Perelroyzen, Evgeni.
Preferred Shelf Number 
TK7874 .P445 2007
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23. 
Cover image for Technology Computer Aided Design for Si, SiGe and GaAs Integrated Circuits
Technology Computer Aided Design for Si, SiGe and GaAs Integrated Circuits
Author 
Maiti, C. K. Armstrong, G. A.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBCS021E
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24. 
Cover image for Reuse-Based Methodologies and Tools in the Design of Analog and Mixed-Signal Integrated Circuits
Reuse-Based Methodologies and Tools in the Design of Analog and Mixed-Signal Integrated Circuits
Author 
CASTRO-LÓPEZ, R. author. FERNÁNDEZ, F.V. author. GUERRA-VINUESA, O. author. RODRÍGUEZ-VÁZQUEZ, Á. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-5139-5
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