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13. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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14. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
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15. 
Cover image for Cognitive Systems and Information Processing 7th International Conference, ICCSIP 2022, Fuzhou, China, December 17-18, 2022, Revised Selected Papers
Cognitive Systems and Information Processing 7th International Conference, ICCSIP 2022, Fuzhou, China, December 17-18, 2022, Revised Selected Papers
Author 
Sun, Fuchun. editor. Cangelosi, Angelo. editor. Zhang, Jianwei. editor. Yu, Yuanlong. editor. Liu, Huaping. editor.
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Electronic Access 
https://doi.org/10.1007/978-981-99-0617-8
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16. 
Cover image for Progress in Sustainable Manufacturing
Progress in Sustainable Manufacturing
Author 
Kandasamy, Jayakrishna. editor. Sakthivel, Aravind Raj. editor. Davim, J. Paulo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0201-9
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17. 
Cover image for Industry 4.0: The Power of Data Selected Papers from the 15th International Conference on Industrial Engineering and Industrial Management
Industry 4.0: The Power of Data Selected Papers from the 15th International Conference on Industrial Engineering and Industrial Management
Author 
Izquierdo, Luis R. editor. Santos, José Ignacio. editor. Lavios, Juan José. editor. Ahedo, Virginia. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-29382-5
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18. 
Cover image for Handbook of Neuroengineering
Handbook of Neuroengineering
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Thakor, Nitish V. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-16-5540-1
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19. 
Cover image for Proceedings of 2nd International Conference on Artificial Intelligence, Robotics, and Communication ICAIRC 2022
Proceedings of 2nd International Conference on Artificial Intelligence, Robotics, and Communication ICAIRC 2022
Author 
Yadav, Sanjay. editor. Kumar, Harish. editor. Kankar, Pavan Kumar. editor. Dai, Wanyang. editor. Huang, Fenghua. editor.
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https://doi.org/10.1007/978-981-99-4554-2
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20. 
Cover image for Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 2
Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 2
Author 
Kabassi, Katerina. editor. Mylonas, Phivos. editor. Caro, Jaime. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-44146-2
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21. 
Cover image for Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 1
Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 1
Author 
Kabassi, Katerina. editor. Mylonas, Phivos. editor. Caro, Jaime. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-44097-7
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22. 
Cover image for Application of nano/microencapsulated ingredients in food products
Application of nano/microencapsulated ingredients in food products
Author 
Jafari, Seid Mahdi.
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ScienceDirect https://www.sciencedirect.com/science/book/9780128157268
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23. 
Cover image for Electronic Packaging Materials and Their Properties
Electronic Packaging Materials and Their Properties
Author 
Pecht, Michael, author. Agarwal, Rakish, author. Dishongh, Terrance J., author. Javadpour, Sirus, author. Mahajan, Rahul, author.
Preferred Shelf Number 
TK7870.15 P434 2017
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24. 
Cover image for Industrial Engineering, Management Science and Applications 2015
Industrial Engineering, Management Science and Applications 2015
Author 
Gen, Mitsuo. editor. Kim, Kuinam J. editor. Huang, Xiaoxia. editor. Hiroshi, Yabe. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-47200-2
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