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25. 
Cover image for Two-dimensional nanomaterials for biosensing and imaging applications
Two-dimensional nanomaterials for biosensing and imaging applications
Author 
Siṃha, Rāma Sevaka, editor. Deshmukh, Kalim, editor. Hussain, Chaudhery Mustansar, editor.
Preferred Shelf Number 
R857 .N34 T86 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394200375
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26. 
Cover image for Mechanical engineering in biomedical applications : Bio-3D printing, biofluid mechanics, implant design, biomaterials, computational biomechanics, tissue mechanics
Mechanical engineering in biomedical applications : Bio-3D printing, biofluid mechanics, implant design, biomaterials, computational biomechanics, tissue mechanics
Author 
Srivastava, Jay Prakash, editor. Kozak, Drazan, editor. Ranjan, Vinayak, editor. Kumar, Pankaj, editor. Kumar, Ranjan, editor.
Preferred Shelf Number 
TJ145
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394175109
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27. 
Cover image for Advanced nanoscale MOSFET architectures : current trends and future perspectives
Advanced nanoscale MOSFET architectures : current trends and future perspectives
Author 
Biswas, Kalyan, editor. Sarkar, Angsuman, editor.
Preferred Shelf Number 
TK7871.95
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188970
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28. 
Cover image for Depolymerization of lignin to produce value added chemicals
Depolymerization of lignin to produce value added chemicals
Author 
Bajpai, Pratima.
Preferred Shelf Number 
TS933 .L5 B35 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394191666
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29. 
Cover image for Organic and inorganic materials based sensors
Organic and inorganic materials based sensors
Author 
Das, Sangita, editor. Thomas, Sabu, editor. Das, Partha Pratim, editor.
Preferred Shelf Number 
TK7872 .D48 O74 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527834266
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30. 
Cover image for Electrospinning : fundamentals, methods, and applications
Electrospinning : fundamentals, methods, and applications
Author 
Wang, Liming, editor. Qin, Xiaohong, editor.
Preferred Shelf Number 
TA418.9 .F5
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527841479
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31. 
Cover image for 2D nanomaterials : synthesis, properties, and applications
2D nanomaterials : synthesis, properties, and applications
Preferred Shelf Number 
TA418.9 .N35 T86 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394167883
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32. 
Cover image for Chemistry, biology and pharmacology of lichen
Chemistry, biology and pharmacology of lichen
Author 
Das, Ashoke Kumar, editor.
Preferred Shelf Number 
QK583 .S53 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394190706
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33. 
Cover image for Nonthermal food engineering operations
Nonthermal food engineering operations
Author 
Kumar, Nitin (Professor of food engineering), editor. Panghal, Anil, editor. Garg, M. K., editor.
Preferred Shelf Number 
TP371 .N66 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119776468
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34. 
Cover image for MEMS and Microfluidics in Healthcare Devices and Applications Perspectives
MEMS and Microfluidics in Healthcare Devices and Applications Perspectives
Author 
Guha, Koushik. editor. Dutta, Gorachand. editor. (orcid)0000-0003-2980-9826 Biswas, Arindam. editor. Srinivasa Rao, K. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-8714-4
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35. 
Cover image for Sustainable Material for Biomedical Engineering Application
Sustainable Material for Biomedical Engineering Application
Author 
Wan Kamarul Zaman, Wan Safwani. editor. Abdullah, Nurul asma. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-2267-3
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36. 
Cover image for Artificial Intelligence and Soft Computing 22nd International Conference, ICAISC 2023, Zakopane, Poland, June 18-22, 2023, Proceedings, Part II
Artificial Intelligence and Soft Computing 22nd International Conference, ICAISC 2023, Zakopane, Poland, June 18-22, 2023, Proceedings, Part II
Author 
Rutkowski, Leszek. editor. Scherer, Rafał. editor. Korytkowski, Marcin. editor. Pedrycz, Witold. editor. (orcid) Tadeusiewicz, Ryszard. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-42508-0
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