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Author

SpringerLink (Online service)

(6)

Brown, William D., 1943-

(2)

Greenhouse, Hal.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Agarwal, Rakish, author.

(1)

Avtgis, Alexander W.

(1)

Barlow, Fred D.

(1)

Blackwell, Glenn R.

(1)

Carney, Charles (Charles F.)

(1)

Cepeda-Rizo, Juan, author.

(1)

(1)

Cressler, John D.

(1)

Del Castillo, Enrique.

(1)

Dishongh, Terrance J., author.

(1)

Dorf, Richard C.

(1)

Elshabini, Aicha.

(1)

Gayle, Jeremiah, author.

(1)

Gerlach, Gerald. editor.

(1)

(1)

Hurwitz, Arnon Max.

(1)

(1)

Jamnia, Ali, 1961- author.

(1)

Javadpour, Sirus, author.

(1)

Lee, Ning-Cheng.

(1)

(1)

Lee, Y. C. editor.

(1)

Li, Yi (Grace). editor.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Liu, Yong. author.

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Madhava Rao, K., editor.

(1)

Mahajan, Rahul, author.

(1)

Mantooth, H. Alan, 1963-

(1)

McCluskey, F. Patrick, author.

(1)

Megow, William F.

(1)

Monkhouse, Donald C.

(1)

Moon, Kyoung-Sik. editor.

(1)

(1)

Osten, Wolfgang.

(1)

Pecht, Michael, author.

(1)

Pecht, Michael.

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Ravich, Joshua, author.

(1)

Remsburg, Ralph., author.

(1)

Romenesko, Bruce.

(1)

Stalter, Kathleen A.

(1)

Suganuma, Katsuaki.

(1)

Suhir, E. editor.

(1)

Suhir, Ephraim.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Tong, Xingcun Colin. author.

(1)

Vasudeva Reddy, T., editor.

(1)

Villanucci, Robert S., 1944-

(1)

Voyiadjis, George Z. editor.

(1)

Walker, C. A. (Colin A.)

(1)

Whitaker, Jerry C.

(1)

Wolter, Klaus-Jürgen. editor.

(1)

(1)

Wong, C. P. editor.

(1)

Wong, C.P. editor.

(1)

Language

(35)

Publication Date

-

(4)

(4)

(4)

(3)

(3)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Electronic packaging.

(18)

(4)

Electronic apparatus and appliances -- Design and construction.

(3)

Electronic books.

(3)

(3)

Microelectronic packaging.

(3)

Microelectronics.

(3)

Nanotechnology.

(3)

Optical materials.

(3)

Solder and soldering.

(3)

Chip scale packaging.

(2)

Electronic apparatus and appliances -- Reliability.

(2)

Electronics -- Materials -- Permeability.

(2)

Extreme environments.

(2)

Sealing (Technology)

(2)

Surfaces (Physics).

(2)

(1)

(1)

Aerospace engineering.

(1)

Amplifiers (Electronics).

(1)

Biomedical engineering.

(1)

(1)

Building materials.

(1)

COMPUTERS / Programming / Algorithms

(1)

Ceramic materials.

(1)

(1)

(1)

Classical Mechanics.

(1)

Contamination (Technology)

(1)

(1)

Dichtung (Technik)

(1)

Drugs -- Testing.

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

Electromagnetics & Microwaves

(1)

Electronic Packaging

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic ceramics.

(1)

Electronic circuits -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Defects -- Prevention.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Materials.

(1)

Electronics -- Materials.

(1)

Elektronik aygıtlar ve aletler -- Tasarım ve yapım.

(1)

Elektronik paketleme -- Kusurlar -- Korunma.

(1)

Elektronik paketleme.

(1)

Elektronisches Bauelement.

(1)

Engineering -- Handbooks, manuals, etc.

(1)

Engineering Mechanics.

(1)

Engineering design.

(1)

Environmental protection.

(1)

Environmental testing.

(1)

Fabrika sağlıklaştırımı.

(1)

Factory sanitation.

(1)

Field-effect transistors.

(1)

Gallium arsenide.

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Interconnects (Integrated circuit technology) -- Design and construction.

(1)

Kontaminasyon (Teknoloji)

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Mechanics, Applied.

(1)

(1)

Microelectromechanical systems.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave transistors.

(1)

Mikroelektronik.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique)

(1)

Mixing circuits.

(1)

Moire method -- Case studies.

(1)

(1)

Nanostructured materials.

(1)

Optical detectors -- Industrial applications.

(1)

Optoelectronic devices.

(1)

Optoelectronics.

(1)

Optoelektronik.

(1)

Oscillators, Electric.

(1)

Particles (Nuclear physics).

(1)

Passive components.

(1)

(1)

Production management.

(1)

Production of electric energy or power.

(1)

Quality control -- Optical methods.

(1)

Sealing (Technology).

(1)

Semiconductor industry -- Production control.

(1)

Semiconductors -- Design and construction.

(1)

Semiconductors.

(1)

Solid Mechanics.

(1)

(1)

Space vehicles -- Electronic equipment -- Design and construction.

(1)

Structural Materials.

(1)

(1)

Systems engineering.

(1)

TECHNOLOGY / Engineering / Civil

(1)

TECHNOLOGY / Engineering / Mechanical

(1)

Telecommunication.

(1)

Material Type

Shelf Location

Beytepe General Collection

Electronic Library

Taylor Francis E-Book Collection

Library

Beytepe Library

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25.

Cover image for Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Author

Licari, James J., 1930- Swanson, Dale W.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815515135

Format:

Availability

Online Library~1

Available:
Copies:

26.

Cover image for The engineering handbook

The engineering handbook

The engineering handbook

Author

Dorf, Richard C.

Preferred Shelf Number

TA151 .E424 2005

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

27.

Cover image for The electronics handbook

The electronics handbook

The electronics handbook

Author

Whitaker, Jerry C.

Preferred Shelf Number

TK7867 .E4244 2005

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

28.

Cover image for MEMS Packaging

Author

Tai-Ran Hsu, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP003E

Format:

Availability

Online Library~1

Available:
Copies:

29.

Cover image for Handbook of Moire measurement

Handbook of Moire measurement

Handbook of Moire measurement

Author

Walker, C. A. (Colin A.)

Preferred Shelf Number

QC415 .H27 2004

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

30.

Cover image for Lead-free soldering in electronics : science, technology and environmental impact

Lead-free soldering in electronics : science, technology and environmental impact

Lead-free soldering in electronics : science, technology and environmental impact

Author

Suganuma, Katsuaki.

Preferred Shelf Number

TK7870.15 .L43 2004

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

31.

Cover image for Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Author

Puttlitz, Karl J. Stalter, Kathleen A.

Preferred Shelf Number

TK7870.15 .H3657 2004

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

32.

Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Author

Lee, Ning-Cheng.

Preferred Shelf Number

ONLINE

Electronic Access

Volltext http://www.sciencedirect.com/science/book/9780750672184

Format:

Availability

Online Library~1

Available:
Copies:

33.

Cover image for Thermal design of electronic equipment

Thermal design of electronic equipment

Thermal design of electronic equipment

Author

Remsburg, Ralph., author.

Preferred Shelf Number

TK7870.25 .R46 2001

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

34.

Cover image for Run-to-run control in semiconductor manufacturing

Run-to-run control in semiconductor manufacturing

Run-to-run control in semiconductor manufacturing

Author

Del Castillo, Enrique. Hurwitz, Arnon Max. Moyne, James.

Preferred Shelf Number

TK7871.85 .R863 2001

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

35.

Cover image for Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Author

Greenhouse, Hal.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815514350

Format:

Availability

Online Library~1

Available:
Copies:

36.

Cover image for Electronic techniques : shop practices and construction

Electronic techniques : shop practices and construction

Electronic techniques : shop practices and construction

Author

Villanucci, Robert S., 1944- Avtgis, Alexander W. Megow, William F.

Preferred Shelf Number

TK7836 .V55 1996

Format:

Availability

Beytepe Library~1

Available:
Copies:

1 2 3 4

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