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1. 
Cover image for Micro electromechanical systems (MEMS) : practical lab manual
Micro electromechanical systems (MEMS) : practical lab manual
Author 
Kumar, Sanjeet. Bhaiyya, Manish. Amreen, Khairunnisa. Kumar, Pavar Sai. Kumar, Abhishek.
Preferred Shelf Number 
TK7875 .K86 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394229864
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2. 
Cover image for Molecular Communications An Analysis from Networking Theories Perspective
Molecular Communications An Analysis from Networking Theories Perspective
Author 
Cevallos, Yesenia. author. Vacacela Gómez, Cristian. author. Tello-Oquendo, Luis. author. (orcid)0000-0002-5274-666X Tene, Talia. author. Inca, Deysi. author.
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-36882-0
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3. 
Cover image for Proceedings of the 4th International Conference on Experimental and Computational Mechanics in Engineering ICECME 2022, Banda Aceh, September 14-15, 2022
Proceedings of the 4th International Conference on Experimental and Computational Mechanics in Engineering ICECME 2022, Banda Aceh, September 14-15, 2022
Author 
Irwansyah. editor. Iqbal, Mohd. editor. Huzni, Syifaul. editor. Akhyar. editor. (orcid)0000-0003-2006-0126 SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-99-7495-5
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4. 
Cover image for Advances in Intelligent Manufacturing and Robotics Selected Articles from ICIMR 2023; 22-23 August, Suzhou, China
Advances in Intelligent Manufacturing and Robotics Selected Articles from ICIMR 2023; 22-23 August, Suzhou, China
Author 
Tan, Andrew. editor. Zhu, Fan. editor. (orcid)0009-0004-2734-6842 Jiang, Haochuan. editor. Mostafa, Kazi. editor. Yap, Eng Hwa. editor.
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ONLINE
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https://doi.org/10.1007/978-981-99-8498-5
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5. 
Cover image for Advances in Nonlinear Dynamics, Volume III Proceedings of the Third International Nonlinear Dynamics Conference (NODYCON 2023)
Advances in Nonlinear Dynamics, Volume III Proceedings of the Third International Nonlinear Dynamics Conference (NODYCON 2023)
Author 
Lacarbonara, Walter. editor. (orcid)0000-0002-8780-281X SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-50635-2
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6. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2023
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2023
Author 
Lenka, Trupti Ranjan. editor. (orcid)0000-0002-8002-3901 Saha, Samar K. editor. (orcid)0000-0002-5687-591X Fu, Lan. editor. (orcid)0000-0002-9070-8373 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-4495-8
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7. 
Cover image for Intelligent Manufacturing and Mechatronics Selected Articles from iM3F 2023, 07-08 August, Pekan, Malaysia
Intelligent Manufacturing and Mechatronics Selected Articles from iM3F 2023, 07-08 August, Pekan, Malaysia
Author 
Mohd. Isa, Wan Hasbullah. editor. Khairuddin, Ismail Mohd. editor. Mohd. Razman, Mohd. Azraai. editor. Saruchi, Sarah 'Atifah. editor. Teh, Sze-Hong. editor.
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https://doi.org/10.1007/978-981-99-8819-8
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8. 
Cover image for Nanofabrication Principles, Capabilities and Limits
Nanofabrication Principles, Capabilities and Limits
Author 
Cui, Zheng. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-62546-6
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9. 
Cover image for Fundamentals of Mechanisms and Machines
Fundamentals of Mechanisms and Machines
Author 
Manik, Dhanesh N. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-1810-8
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10. 
Cover image for Nanomedicine
Nanomedicine
Author 
Gu, Ning. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-16-8984-0
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11. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-19-2308-1
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12. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-19-9917-8
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