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25. 
Cover image for Nanotribology and Nanomechanics An Introduction
Nanotribology and Nanomechanics An Introduction
Author 
Bhushan, Bharat. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-77608-6
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26. 
Cover image for Semiconductor Nanostructures
Semiconductor Nanostructures
Author 
Bimberg, Dieter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-77899-8
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27. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76534-1
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28. 
Cover image for Springer Handbook of Electronic and Photonic Materials
Springer Handbook of Electronic and Photonic Materials
Author 
Kasap, Safa. editor. Capper, Peter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-29185-7
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29. 
Cover image for Fundamentals of Nanoscale Film Analysis
Fundamentals of Nanoscale Film Analysis
Author 
Alford, Terry L. author. Feldman, Leonard C. author. Mayer, James W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-29261-8
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30. 
Cover image for Laser Ablation and its Applications
Laser Ablation and its Applications
Author 
Phipps, Claude. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-30453-3
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31. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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32. 
Cover image for Physics of Ferroelectrics A Modern Perspective
Physics of Ferroelectrics A Modern Perspective
Author 
Rabe, Karin M. editor. Ahn, Charles H. editor. Triscone, Jean-Marc. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-34591-6
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33. 
Cover image for Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Author 
Laconte, J. author. Flandre, D. author. Raskin, J. -P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-28843-0
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34. 
Cover image for Handbook of Advanced Magnetic Materials
Handbook of Advanced Magnetic Materials
Author 
Liu, Yi. editor. Sellmyer, David J. editor. Shindo, Daisuke. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b115335
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35. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-84628-235-7
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36. 
Cover image for Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Author 
Imanaka, Yoshihiko. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b101196
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