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25. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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26. 
Cover image for Computational Methods for Microstructure-Property Relationships
Computational Methods for Microstructure-Property Relationships
Author 
Ghosh, Somnath. editor. Dimiduk, Dennis. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0643-4
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27. 
Cover image for Dynamic Behavior of Materials, Volume 1 Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics
Dynamic Behavior of Materials, Volume 1 Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics
Author 
Proulx, Tom. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0216-9
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28. 
Cover image for MEMS Materials and Processes Handbook
MEMS Materials and Processes Handbook
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Ghodssi, Reza. editor. Lin, Pinyen. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-47318-5
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29. 
Cover image for Nonlinear Mechanics of Crystals
Nonlinear Mechanics of Crystals
Author 
Clayton, John D. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-0350-6
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30. 
Cover image for Recent Advances in the Processing of Wood-Plastic Composites
Recent Advances in the Processing of Wood-Plastic Composites
Author 
Kim, Jin Kuk. author. Pal, Kaushik. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-14877-4
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31. 
Cover image for Heat Transfer in Multi-Phase Materials
Heat Transfer in Multi-Phase Materials
Author 
Öchsner, Andreas. editor. Murch, Graeme E. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-04403-8
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32. 
Cover image for Mechanics of Crustal Rocks
Mechanics of Crustal Rocks
Author 
Leroy, Yves M. editor. Lehner, Florian K. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-7091-0939-7
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33. 
Cover image for The Physics of Solids Essentials and Beyond
The Physics of Solids Essentials and Beyond
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Economou, Eleftherios N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02069-8
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34. 
Cover image for Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
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Breitenstein, Otwin. author. Warta, Wilhelm. author. Langenkamp, Martin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02417-7
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35. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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36. 
Cover image for Device Physics of Narrow Gap Semiconductors
Device Physics of Narrow Gap Semiconductors
Author 
Chu, Junhao. author. Sher, Arden. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1040-0
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