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25. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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26. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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27. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-310-7
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28. 
Cover image for Electronic Properties of Materials
Electronic Properties of Materials
Author 
Hummel, Rolf E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8164-6
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29. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9377-9
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30. 
Cover image for Organische Elektronik in Deutschland Bewertung und Empfehlungen Für Die Weiterentwicklung.
Organische Elektronik in Deutschland Bewertung und Empfehlungen Für Die Weiterentwicklung.
Author 
acatech - Deutsche Akademie der Technikwissenschaften. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-20461-6
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31. 
Cover image for Deterministic Solvers for the Boltzmann Transport Equation
Deterministic Solvers for the Boltzmann Transport Equation
Author 
Hong, Sung-Min. author. Pham, Anh-Tuan. author. Jungemann, Christoph. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-7091-0778-2
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32. 
Cover image for Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Author 
Pardo, Lorena. author. Ricote, Jesús. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-2875-4
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33. 
Cover image for Cellular Nanoscale Sensory Wave Computing
Cellular Nanoscale Sensory Wave Computing
Author 
Baatar, Chagaan. editor. Porod, Wolfgang. editor. Roska, Tamás. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1011-0
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34. 
Cover image for Nanoscale Photonics and Optoelectronics Science and Technology
Nanoscale Photonics and Optoelectronics Science and Technology
Author 
Wang, Zhiming M. editor. Neogi, Arup. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7587-4
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35. 
Cover image for Strain Effect in Semiconductors Theory and Device Applications
Strain Effect in Semiconductors Theory and Device Applications
Author 
Sun, Yongke. author. Thompson, Scott E. author. Nishida, Toshikazu. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0552-9
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36. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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