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1. 
Cover image for Liquid Crystalline Semiconductors Materials, properties and applications
Liquid Crystalline Semiconductors Materials, properties and applications
Author 
Bushby, Richard J. editor. Kelly, Stephen M. editor. O'Neill, Mary. editor. SpringerLink (Online service)
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ONLINE(335654.1)
Electronic Access 
http://dx.doi.org/10.1007/978-90-481-2873-0
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2. 
Cover image for Spintronics From Materials to Devices
Spintronics From Materials to Devices
Author 
Felser, Claudia. editor. Fecher, Gerhard H. editor. SpringerLink (Online service)
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ONLINE(335658.1)
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http://dx.doi.org/10.1007/978-90-481-3832-6
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Cover image for Werkstoffe Unsichtbar, aber unverzichtbar
Werkstoffe Unsichtbar, aber unverzichtbar
Author 
Weitze, Marc-Denis. author. Berger, Christina. author. SpringerLink (Online service)
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ONLINE(336961.1)
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http://dx.doi.org/10.1007/978-3-642-29541-6
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4. 
Cover image for Handbook of Spectral Lines in Diamond Volume 1: Tables and Interpretations
Handbook of Spectral Lines in Diamond Volume 1: Tables and Interpretations
Author 
Dischler, Bernhard. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-22215-3
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5. 
Cover image for GaN and ZnO-based Materials and Devices
GaN and ZnO-based Materials and Devices
Author 
Pearton, Stephen. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-23521-4
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6. 
Cover image for Theory of Charge Transport in Carbon Electronic Materials
Theory of Charge Transport in Carbon Electronic Materials
Author 
Shuai, Zhigang. author. Wang, Linjun. author. Song, Chenchen. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-25076-7
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7. 
Cover image for Conducting Polymers A New Era in Electrochemistry
Conducting Polymers A New Era in Electrochemistry
Author 
Inzelt, György. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27621-7
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8. 
Cover image for Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Author 
Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-28522-6
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9. 
Cover image for Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Author 
Laurila, Tomi. author. Vuorinen, Vesa. author. Paulasto-Kröckel, Mervi. author. Turunen, Markus. author. Mattila, Toni T. author.
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http://dx.doi.org/10.1007/978-1-4471-2470-2
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10. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-236-0
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11. 
Cover image for Scanning Transmission Electron Microscopy Imaging and Analysis
Scanning Transmission Electron Microscopy Imaging and Analysis
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Pennycook, Stephen J. editor. Nellist, Peter D. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7200-2
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12. 
Cover image for Physics and Technology of Amorphous-Crystalline Heterostructure Silicon Solar Cells
Physics and Technology of Amorphous-Crystalline Heterostructure Silicon Solar Cells
Author 
Sark, Wilfried G. J. H. M. editor. Korte, Lars. editor. Roca, Francesco. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-22275-7
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