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1. 
Cover image for Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Author 
Joy, Soumitra R.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394290000
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2. 
Cover image for Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Author 
Li, Wei. author. Yuan, Xin'an. author. Zhao, Jianming. author. Yin, Xiaokang. author. Li, Xiao. author.
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-7255-1
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3. 
Cover image for Embedded Machine Learning with Microcontrollers Applications on Arduino Boards
Embedded Machine Learning with Microcontrollers Applications on Arduino Boards
Author 
Ünsalan, Cem. author. (orcid)0000-0002-8904-3730 Höke, Berkan. author. (orcid)0000-0001-5682-500X Atmaca, Eren. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-69421-9
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4. 
Cover image for Nanometer CMOS ICs From Basics to ASICs
Nanometer CMOS ICs From Basics to ASICs
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Veendrick, Harry. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-64249-4
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5. 
Cover image for Embedded Machine Learning with Microcontrollers Applications on STM32 Development Boards
Embedded Machine Learning with Microcontrollers Applications on STM32 Development Boards
Author 
Ünsalan, Cem. author. (orcid)0000-0002-8904-3730 Höke, Berkan. author. (orcid)0000-0001-5682-500X Atmaca, Eren. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-70912-8
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6. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume I
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-8780-7
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7. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume V
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume V
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-8824-8
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8. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VI
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VI
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-8828-6
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9. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume II
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume II
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-8812-5
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10. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume III
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume III
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-8816-3
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11. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VII
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VII
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-8832-3
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12. 
Cover image for Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Author 
Bhateja, Vikrant. editor. Chakravarthy, V. V. S. S. S. editor. Anguera, Jaume. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Flores Fuentes, Wendy. editor. (orcid)0000-0002-1477-7449
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https://doi.org/10.1007/978-981-97-8422-6
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