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25. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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26. 
Cover image for Hot Cracking Phenomena in Welds
Hot Cracking Phenomena in Welds
Author 
Böllinghaus, Thomas. editor. Herold, Horst. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b139103
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Availability 
Online Library~1
Available:
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