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1. 
Cover image for The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022)
The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022)
Author 
Ma, Chengbin. editor. Zhang, Yiming. editor. Li, Siqi. editor. Zhao, Lei. editor. Liu, Ming. editor.
Preferred Shelf Number 
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Electronic Access 
https://doi.org/10.1007/978-981-99-0631-4
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2. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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3. 
Cover image for Designing Mobile Robot Interfaces with 16-bit Microchip Microcontrollers
Designing Mobile Robot Interfaces with 16-bit Microchip Microcontrollers
Author 
Bindal, Ahmet. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-27841-9
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4. 
Cover image for From Algorithms to Hardware Architectures Using Digital Radios as a Design Example
From Algorithms to Hardware Architectures Using Digital Radios as a Design Example
Author 
Abbas, Karim. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-08693-9
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5. 
Cover image for Mathematical Modeling of Physical Systems Applications of Fields, Circuits and Signal Processing
Mathematical Modeling of Physical Systems Applications of Fields, Circuits and Signal Processing
Author 
Chattopadhyay, Adhir Baran. author. Hasan, Shazia. author. Chowdhury, Snehaunshu. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-7558-5
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6. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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7. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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8. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
Author 
Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0408-2
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9. 
Cover image for Engineering Design A Survival Guide to Senior Capstone
Engineering Design A Survival Guide to Senior Capstone
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Mettler, Cory J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-23309-8
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10. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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11. 
Cover image for Advances in Data-driven Computing and Intelligent Systems Selected Papers from ADCIS 2022, Volume 2
Advances in Data-driven Computing and Intelligent Systems Selected Papers from ADCIS 2022, Volume 2
Author 
Das, Swagatam. editor. Saha, Snehanshu. editor. Coello Coello, Carlos A. editor. Bansal, Jagdish Chand. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0981-0
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12. 
Cover image for Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Author 
Harpe, Pieter. editor. Baschirotto, Andrea. editor. Makinwa, Kofi A.A. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-28912-5
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