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25. 
Cover image for Fundamentals of Bias Temperature Instability in MOS Transistors Characterization Methods, Process and Materials Impact, DC and AC Modeling
Fundamentals of Bias Temperature Instability in MOS Transistors Characterization Methods, Process and Materials Impact, DC and AC Modeling
Author 
Mahapatra, Souvik. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-2508-9
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26. 
Cover image for Current Conveyors Variants, Applications and Hardware Implementations
Current Conveyors Variants, Applications and Hardware Implementations
Author 
Senani, Raj. author. Bhaskar, D. R. author. Singh, A. K. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-08684-2
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27. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-1-4614-9176-7
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