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25. 
Cover image for Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Author 
Ng, Leonard W. T. author. Hu, Guohua. author. Howe, Richard C. T. author. Zhu, Xiaoxi. author. Yang, Zongyin. author.
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https://doi.org/10.1007/978-3-319-91572-2
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26. 
Cover image for Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Author 
Ueda, Osamu. editor. Pearton, Stephen J. editor. SpringerLink (Online service)
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ONLINE(331478.1)
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http://dx.doi.org/10.1007/978-1-4614-4337-7
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27. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
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Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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28. 
Cover image for Ambient Intelligence with Microsystems Augmented Materials and Smart Objects
Ambient Intelligence with Microsystems Augmented Materials and Smart Objects
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Delaney, Kieran. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-46264-6
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29. 
Cover image for Nanoelectronics and Photonics From Atoms to Materials, Devices, and Architectures
Nanoelectronics and Photonics From Atoms to Materials, Devices, and Architectures
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Korkin, Anatoli. editor. Rosei, Federico. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76499-3
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30. 
Cover image for Frontiers of Ferroelectricity A Special Issue of the Journal of Materials Science
Frontiers of Ferroelectricity A Special Issue of the Journal of Materials Science
Author 
Lang, Sidney B. author. Chan, Helen L. W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-38039-1
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31. 
Cover image for Adaptronics and Smart Structures Basics, Materials, Design and Applications
Adaptronics and Smart Structures Basics, Materials, Design and Applications
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Janocha, Hartmut. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-71967-0
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32. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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33. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
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Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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34. 
Cover image for Microscopy of Semiconducting Materials Proceedings of the 14th Conference, April 11–14, 2005, Oxford, UK
Microscopy of Semiconducting Materials Proceedings of the 14th Conference, April 11–14, 2005, Oxford, UK
Author 
Cullis, A. G. editor. Hutchison, J. L. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/3-540-31915-8
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35. 
Cover image for Photonic Crystal Fibers Properties and Applications
Photonic Crystal Fibers Properties and Applications
Author 
Poli, Federica. author. Cucinotta, Annamaria. author. Selleri, Stefano. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6326-8
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36. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-507-9
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