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25. 
Cover image for Smart Systems Integration and Simulation
Smart Systems Integration and Simulation
Author 
Bombieri, Nicola. editor. Poncino, Massimo. editor. Pravadelli, Graziano. editor. (orcid)0000-0002-7833-1673 SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-27392-1
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26. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-06773-5
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27. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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28. 
Cover image for Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Author 
Maharatna, Koushik. editor. Dalapati, Goutam Kumar. editor. Banerjee, P K. editor. Mallick, Amiya Kumar. editor. Mukherjee, Moumita. editor.
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https://doi.org/10.1007/978-81-322-2274-3
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29. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9176-7
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