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25. 
Cover image for Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Author 
Imanaka, Yoshihiko. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/b101196
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26. 
Cover image for Integrated Chemical Microsensor Systems in CMOS Technology
Integrated Chemical Microsensor Systems in CMOS Technology
Author 
Hierlemann, Andreas. author. Baltes, H. editor. Fujita, Hiroyuki. editor. Liepmann, Dorian. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138987
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27. 
Cover image for Vibrations in the Production System Measurement and Analysis with Water Jet Technology
Vibrations in the Production System Measurement and Analysis with Water Jet Technology
Author 
Olejárová, Štefánia. author. Ružbarský, Juraj. author. Krenický, Tibor. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-01737-8
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28. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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29. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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30. 
Cover image for Proceedings of the Tiangong-2 Remote Sensing Application Conference Technology, Method and Application
Proceedings of the Tiangong-2 Remote Sensing Application Conference Technology, Method and Application
Author 
Gu, Yidong. editor. Gao, Ming. editor. Zhao, Guangheng. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3501-3
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31. 
Cover image for Device Physics, Modeling, Technology, and Analysis for Silicon MESFET
Device Physics, Modeling, Technology, and Analysis for Silicon MESFET
Author 
Amiri, Iraj Sadegh. author. Mohammadi, Hossein. author. Hosseinghadiry, Mahdiar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-04513-5
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32. 
Cover image for Semi-physical Verification Technology for Dynamic Performance of Internet of Things System
Semi-physical Verification Technology for Dynamic Performance of Internet of Things System
Author 
Yu, Xiaolei. author. Wang, Donghua. author. Zhao, Zhimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-1759-0
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33. 
Cover image for Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Author 
Ng, Leonard W. T. author. Hu, Guohua. author. Howe, Richard C. T. author. Zhu, Xiaoxi. author. Yang, Zongyin. author.
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https://doi.org/10.1007/978-3-319-91572-2
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34. 
Cover image for Memristor Technology: Synthesis and Modeling for Sensing and Security Applications
Memristor Technology: Synthesis and Modeling for Sensing and Security Applications
Author 
Abunahla, Heba. author. Mohammad, Baker. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-65699-1
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35. 
Cover image for Tantalum and Niobium-Based Capacitors Science, Technology, and Applications
Tantalum and Niobium-Based Capacitors Science, Technology, and Applications
Author 
Freeman, Yuri. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-67870-2
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36. 
Cover image for The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
Author 
Ab. Hamid, Khairuddin. editor. Ono, Osamu. editor. Bostamam, Anas Muhamad. editor. Poh Ai Ling, Amy. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54439-5
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