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25. 
Cover image for Nonsmooth Modeling and Simulation for Switched Circuits
Nonsmooth Modeling and Simulation for Switched Circuits
Author 
Acary, Vincent. author. Bonnefon, Olivier. author. Brogliato, Bernard. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-90-481-9681-4
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26. 
Cover image for Oscillation-Based Test in Mixed-Signal Circuits
Oscillation-Based Test in Mixed-Signal Circuits
Author 
Sánchez, Gloria Huertas. author. García de la Vega, Diego Vázquez. author. Rueda, Adoración Rueda. author. Díaz, José Luis Huertas. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-5315-0
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27. 
Cover image for Transient Analysis of Electric Power Circuits Handbook
Transient Analysis of Electric Power Circuits Handbook
Author 
Shenkman, Arieh L. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-28799-X
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28. 
Cover image for Radiation Hardened CMOS Integrated Circuits for Time-Based Signal Processing
Radiation Hardened CMOS Integrated Circuits for Time-Based Signal Processing
Author 
Prinzie, Jeffrey. author. Steyaert, Michiel. author. Leroux, Paul. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-78616-2
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29. 
Cover image for Parasitic Substrate Coupling in High Voltage Integrated Circuits Minority and Majority Carriers Propagation in Semiconductor Substrate
Parasitic Substrate Coupling in High Voltage Integrated Circuits Minority and Majority Carriers Propagation in Semiconductor Substrate
Author 
Buccella, Pietro. author. Stefanucci, Camillo. author. Kayal, Maher. author. Sallese, Jean-Michel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-74382-0
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30. 
Cover image for Design of Organic Complementary Circuits and Systems on Foil
Design of Organic Complementary Circuits and Systems on Foil
Author 
Abdinia, Sahel. author. van Roermund, Arthur. author. Cantatore, Eugenio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-21188-6
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31. 
Cover image for Arbitrary Modeling of TSVs for 3D Integrated Circuits
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author 
Salah, Khaled. author. Ismail, Yehea. author. El-Rouby, Alaa. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-07611-9
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32. 
Cover image for Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
Author 
Reynders, Nele. author. Dehaene, Wim. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-16136-5
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33. 
Cover image for High Performance Multi-Channel High-Speed I/O Circuits
High Performance Multi-Channel High-Speed I/O Circuits
Author 
Oh, Taehyoun. author. Harjani, Ramesh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-4963-8
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34. 
Cover image for Ultra-Low Power Integrated Circuit Design Circuits, Systems, and Applications
Ultra-Low Power Integrated Circuit Design Circuits, Systems, and Applications
Author 
Tan, Nianxiong Nick. editor. Li, Dongmei. editor. Wang, Zhihua. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4419-9973-3
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35. 
Cover image for Precision Instrumentation Amplifiers and Read-Out Integrated Circuits
Precision Instrumentation Amplifiers and Read-Out Integrated Circuits
Author 
Wu, Rong. author. Huijsing, Johan H. author. Makinwa, Kofi A. A. author. SpringerLink (Online service)
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ONLINE(331369.1)
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http://dx.doi.org/10.1007/978-1-4614-3731-4
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36. 
Cover image for Circuits and Systems for Future Generations of Wireless Communications
Circuits and Systems for Future Generations of Wireless Communications
Author 
Tasić, Aleksandar. editor. Serdijn, Wouter A. editor. Larson, Lawrence E. editor. Setti, Gianluca. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9917-5
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