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25. 
Cover image for Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Author 
Siano, Pierluigi. editor. Williamson, Sheldon. editor. Beevi, Sabeena. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0915-5
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26. 
Cover image for Switched Inductor Power IC Design
Switched Inductor Power IC Design
Author 
Rincón-Mora, Gabriel Alfonso. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-95899-2
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27. 
Cover image for Essentials of C Programming with Microsoft® Visual Studio®
Essentials of C Programming with Microsoft® Visual Studio®
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Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-35711-4
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28. 
Cover image for Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-1906-0
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29. 
Cover image for High-Speed System and Analog Input/Output Design
High-Speed System and Analog Input/Output Design
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Tran, Thanh T. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-04954-5
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30. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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31. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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32. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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33. 
Cover image for Microelectronics, Circuits and Systems Select Proceedings of Micro2021
Microelectronics, Circuits and Systems Select Proceedings of Micro2021
Author 
Biswas, Abhijit. editor. Islam, Aminul. editor. Chaujar, Rishu. editor. Jaksic, Olga. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0412-9
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34. 
Cover image for System on Chip (SOC) Architecture A Practical Approach
System on Chip (SOC) Architecture A Practical Approach
Author 
Chakravarthi, Veena S. author. Koteshwar, Shivananda R. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-36242-2
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35. 
Cover image for Integrated Electronic Payment Technologies for Smart Cities
Integrated Electronic Payment Technologies for Smart Cities
Author 
Graham, Don. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-38222-2
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36. 
Cover image for Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Author 
Ďuďák, Juraj. author. Gašpar, Gabriel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30152-0
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