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Cover image for Datenaustausch in der Anlagenplanung mit AutomationML Integration von CAEX, PLCopen XML und COLLADA
Datenaustausch in der Anlagenplanung mit AutomationML Integration von CAEX, PLCopen XML und COLLADA
Author 
Draht, Rainer. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-642-04674-2
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Cover image for Soft Computing in Industrial Applications Algorithms, Integration, and Success Stories
Soft Computing in Industrial Applications Algorithms, Integration, and Success Stories
Author 
Gao, Xiao-Zhi. editor. Gaspar-Cunha, António. editor. Köppen, Mario. editor. Schaefer, Gerald. editor. Wang, Jun. editor.
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http://dx.doi.org/10.1007/978-3-642-11282-9
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Cover image for The Role of Model Integration in Complex Systems Modelling An Example from Cancer Biology
The Role of Model Integration in Complex Systems Modelling An Example from Cancer Biology
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Patel, Manish. author. Nagl, Sylvia. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-15603-8
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Cover image for Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008
Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008
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Hahn, Hernsoo. editor. Ko, Hanseok. editor. Lee, Sukhan. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-89859-7
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5. 
Cover image for Silicon Devices and Process Integration Deep Submicron and Nano-Scale Technologies
Silicon Devices and Process Integration Deep Submicron and Nano-Scale Technologies
Author 
El-Kareh, Badih. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-69010-0
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Cover image for Numerics of Unilateral Contacts and Friction Modeling and Numerical Time Integration in Non-Smooth Dynamics
Numerics of Unilateral Contacts and Friction Modeling and Numerical Time Integration in Non-Smooth Dynamics
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Studer, Christian. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-01100-9
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Cover image for Electromagnetic Compatibility for Device Design and System Integration
Electromagnetic Compatibility for Device Design and System Integration
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Gonschorek, Karl-Heinz. author. Vick, Ralf. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-03290-5
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Cover image for Low-Power High-Speed ADCs for Nanometer CMOS Integration
Low-Power High-Speed ADCs for Nanometer CMOS Integration
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Cao, Zhiheng. author. Yan, Shouli. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-8450-8
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9. 
Cover image for Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms
Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms
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Wieferink, Andreas. author. Meyr, Heinrich. author. Leupers, Rainer. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-8652-6
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10. 
Cover image for Hydrogen-based Autonomous Power Systems Techno-economic Analysis of the Integration of Hydrogen in Autonomous Power Systems
Hydrogen-based Autonomous Power Systems Techno-economic Analysis of the Integration of Hydrogen in Autonomous Power Systems
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Zoulias, Emmanuel I. author. Lymberopoulos, N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84800-247-0
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11. 
Cover image for Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
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Ballas, Rüdiger G. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-32642-7
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12. 
Cover image for Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
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Laconte, J. author. Flandre, D. author. Raskin, J. -P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-28843-0
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