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25. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
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Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2128-7
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26. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-25376-8
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27. 
Cover image for Carbon for Sensing Devices
Carbon for Sensing Devices
Author 
Demarchi, Danilo. editor. Tagliaferro, Alberto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08648-4
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28. 
Cover image for Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting
Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting
Author 
Nazarov, Alexei. editor. Balestra, Francis. editor. Kilchytska, Valeriya. editor. Flandre, Denis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08804-4
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