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1. 
Cover image for Advances in Intelligent Manufacturing and Mechatronics Selected Articles from the Innovative Manufacturing, Mechatronics & Materials Forum (iM3F 2022), Pahang, Malaysia
Advances in Intelligent Manufacturing and Mechatronics Selected Articles from the Innovative Manufacturing, Mechatronics & Materials Forum (iM3F 2022), Pahang, Malaysia
Author 
Abdullah, Muhammad Amirul. editor. Khairuddin, Ismail Mohd. editor. Ab. Nasir, Ahmad Fakhri. editor. Mohd. Isa, Wan Hasbullah. editor. Mohd. Razman, Mohd. Azraai. editor.
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-8703-8
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2. 
Cover image for Nanomedicine
Nanomedicine
Author 
Gu, Ning. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-16-8984-0
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3. 
Cover image for Micro and Nano Fabrication Tools and Processes
Micro and Nano Fabrication Tools and Processes
Author 
Gatzen, Hans H. author. Saile, Volker. author. Leuthold, Jürg. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-44395-8
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4. 
Cover image for Intelligent Computing, Communication and Devices Proceedings of ICCD 2014, Volume 1
Intelligent Computing, Communication and Devices Proceedings of ICCD 2014, Volume 1
Author 
Jain, Lakhmi C. editor. Patnaik, Srikanta. editor. Ichalkaranje, Nikhil. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2012-1
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5. 
Cover image for Frontiers of Graphene and Carbon Nanotubes Devices and Applications
Frontiers of Graphene and Carbon Nanotubes Devices and Applications
Author 
Matsumoto, Kazuhiko. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-55372-4
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6. 
Cover image for Nanoscale Surface Modification for Enhanced Biosensing A Journey Toward Better Glucose Monitoring
Nanoscale Surface Modification for Enhanced Biosensing A Journey Toward Better Glucose Monitoring
Author 
Zhang, Guigen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17479-2
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7. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-25376-8
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8. 
Cover image for Nanotechnology for Chemical Engineers
Nanotechnology for Chemical Engineers
Author 
Salaheldeen Elnashaie, Said. author. Danafar, Firoozeh. author. Hashemipour Rafsanjani, Hassan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-287-496-2
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9. 
Cover image for Techniques for Nanoencapsulation of Food Ingredients
Techniques for Nanoencapsulation of Food Ingredients
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Anandharamakrishnan, C. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9387-7
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10. 
Cover image for Proceedings of the International Colloquium in Textile Engineering, Fashion, Apparel and Design 2014 (ICTEFAD 2014)
Proceedings of the International Colloquium in Textile Engineering, Fashion, Apparel and Design 2014 (ICTEFAD 2014)
Author 
Ahmad, Mohd Rozi. editor. Yahya, Mohamad Faizul. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-287-011-7
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11. 
Cover image for Adhesion aspects in MEMS-NEMS
Adhesion aspects in MEMS-NEMS
Author 
Kim, Seong H. Dugger, Michael T. Mittal, K. L., 1945-
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TK7875 .A34 2010
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12. 
Cover image for Separation methods in microanalytical systems
Separation methods in microanalytical systems
Author 
Kutter, Jörg P. Fintschenko, Yolanda.
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TP156.S45 S392 2006
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