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1. 
Cover image for From additive manufacturing to 3D/4D printing. 2, Current techniques, improvements and their limitations
From additive manufacturing to 3D/4D printing. 2, Current techniques, improvements and their limitations
Author 
André, Jean-Claude, author.
Preferred Shelf Number 
TS171.95
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119428299
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2. 
Cover image for Microelectronic circuits
Microelectronic circuits
Author 
Sedra, Adel S., author. Smith, Kenneth C. (Kenneth Carless), author.
Preferred Shelf Number 
TK7867 S43 2016
Format: 
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Beytepe Library~1
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3. 
Cover image for Design Exploration of Emerging Nano-scale Non-volatile Memory
Design Exploration of Emerging Nano-scale Non-volatile Memory
Author 
Yu, Hao. author. Wang, Yuhao. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-0551-5
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4. 
Cover image for Cognitive Radio Receiver Front-Ends RF/Analog Circuit Techniques
Cognitive Radio Receiver Front-Ends RF/Analog Circuit Techniques
Author 
Sadhu, Bodhisatwa. author. Harjani, Ramesh. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9296-2
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5. 
Cover image for Sensors and Microsystems Proceedings of the 17th National Conference, Brescia, Italy, 5-7 February 2013
Sensors and Microsystems Proceedings of the 17th National Conference, Brescia, Italy, 5-7 February 2013
Author 
Di Natale, Corrado. editor. Ferrari, Vittorio. editor. Ponzoni, Andrea. editor. Sberveglieri, Giorgio. editor. Ferrari, Marco. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-00684-0
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6. 
Cover image for Embedded Memory Design for Multi-Core and Systems on Chip
Embedded Memory Design for Multi-Core and Systems on Chip
Author 
Mohammad, Baker. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-8881-1
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7. 
Cover image for Linear CMOS RF Power Amplifiers A Complete Design Workflow
Linear CMOS RF Power Amplifiers A Complete Design Workflow
Author 
Solar Ruiz, Hector. author. Berenguer Pérez, Roc. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-8657-2
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8. 
Cover image for Design and Analysis of Spiral Inductors
Design and Analysis of Spiral Inductors
Author 
Haobijam, Genemala. author. Palathinkal, Roy Paily. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-1515-8
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9. 
Cover image for Ultra-Low Power Integrated Circuit Design Circuits, Systems, and Applications
Ultra-Low Power Integrated Circuit Design Circuits, Systems, and Applications
Author 
Tan, Nianxiong Nick. editor. Li, Dongmei. editor. Wang, Zhihua. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4419-9973-3
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10. 
Cover image for Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Author 
Balasinski, Artur. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-1761-3
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11. 
Cover image for Advanced Symbolic Analysis for VLSI Systems Methods and Applications
Advanced Symbolic Analysis for VLSI Systems Methods and Applications
Author 
Shi, Guoyong. author. Tan, Sheldon X.-D. author. Tlelo Cuautle, Esteban. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1103-5
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12. 
Cover image for Memristors and Memristive Systems
Memristors and Memristive Systems
Author 
Tetzlaff, Ronald. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9068-5
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