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1. 
Cover image for Piezoelectric MEMS Resonators
Piezoelectric MEMS Resonators
Author 
Bhugra, Harmeet. editor. Piazza, Gianluca. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-28688-4
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2. 
Cover image for Elements of Plasma Technology
Elements of Plasma Technology
Author 
Wong, Chiow San. author. Mongkolnavin, Rattachat. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-10-0117-8
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3. 
Cover image for Handbook of Visual Display Technology
Handbook of Visual Display Technology
Author 
Chen, Janglin. editor. Cranton, Wayne. editor. Fihn, Mark. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-14346-0
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4. 
Cover image for Ferromagnetic Microwire Composites From Sensors to Microwave Applications
Ferromagnetic Microwire Composites From Sensors to Microwave Applications
Author 
Peng, Hua-Xin. author. Qin, Faxiang. author. Phan, Manh-Huong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29276-2
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5. 
Cover image for Nanoporous Metals for Advanced Energy Technologies
Nanoporous Metals for Advanced Energy Technologies
Author 
Ding, Yi. author. Zhang, Zhonghua. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29749-1
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6. 
Cover image for Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Author 
Kaltenbacher, Manfred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-40170-1
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7. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09111-2
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8. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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9. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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10. 
Cover image for Applications of Graphene An Overview
Applications of Graphene An Overview
Author 
Wolf, E. L. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-03946-6
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11. 
Cover image for Nanowire Field Effect Transistors: Principles and Applications
Nanowire Field Effect Transistors: Principles and Applications
Author 
Kim, Dae Mann. editor. Jeong, Yoon-Ha. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-8124-9
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12. 
Cover image for Integration of Functional Oxides with Semiconductors
Integration of Functional Oxides with Semiconductors
Author 
Demkov, Alexander A. author. Posadas, Agham B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9320-4
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