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25. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE(330808.1)
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http://dx.doi.org/10.1007/978-1-4419-5768-9
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26. 
Cover image for Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Author 
Ueda, Osamu. editor. Pearton, Stephen J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331478.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4337-7
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27. 
Cover image for Sensors An Introductory Course
Sensors An Introductory Course
Author 
Kalantar-zadeh, Kourosh. author. SpringerLink (Online service)
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ONLINE(331661.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5052-8
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