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Author

SpringerLink (Online service)

(6)

Brown, William D., 1943-

(2)

Greenhouse, Hal.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Agarwal, Rakish, author.

(1)

Avtgis, Alexander W.

(1)

Barlow, Fred D.

(1)

Bath, Jasbir, editor.

(1)

Blackwell, Glenn R.

(1)

Carney, Charles (Charles F.)

(1)

Cepeda-Rizo, Juan, author.

(1)

Chen, Chih, 1970- author.

(1)

Chen, Hung-Ming, author.

(1)

(1)

Cressler, John D.

(1)

Del Castillo, Enrique.

(1)

Dishongh, Terrance J., author.

(1)

Domingo, George, 1937- author.

(1)

Dorf, Richard C.

(1)

Elshabini, Aicha.

(1)

Gayle, Jeremiah, author.

(1)

Gerlach, Gerald. editor.

(1)

(1)

Huang, Wei, editor.

(1)

Hurwitz, Arnon Max.

(1)

(1)

Jamnia, Ali, 1961- author.

(1)

Javadpour, Sirus, author.

(1)

Keser, Beth, 1971- editor.

(1)

Kroehnert, Steffen, 1970- editor.

(1)

Lee, Ning-Cheng.

(1)

(1)

Lee, Y. C. editor.

(1)

Li, Yi (Grace). editor.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Liu, Yong. author.

(1)

Lorenzelli, Leandro, author.

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Madhava Rao, K., editor.

(1)

Mahajan, Rahul, author.

(1)

Manjakkal, Libu, author.

(1)

Manning, Louise, editor.

(1)

Mantooth, H. Alan, 1963-

(1)

Martín, Ferran, 1965- author.

(1)

McCluskey, F. Patrick, author.

(1)

Megow, William F.

(1)

Meng, Hong, editor.

(1)

Monkhouse, Donald C.

(1)

Moon, Kyoung-Sik. editor.

(1)

(1)

Muñoz-Enano, Jonathan, author.

(1)

Nakamura, Shozo (Professor Emeritus), author.

(1)

Osten, Wolfgang.

(1)

Pecht, Michael, author.

(1)

Pecht, Michael.

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Ravich, Joshua, author.

(1)

Remsburg, Ralph., author.

(1)

Romenesko, Bruce.

(1)

Sharif, Ahmed, editor.

(1)

Stalter, Kathleen A.

(1)

Su, Lijuan, author.

(1)

Suganuma, Katsuaki.

(1)

Suhir, E. editor.

(1)

Suhir, Ephraim.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Tenhunen, Hannu, author.

(1)

Tian, Xingyou, editor.

(1)

Tong, Xingcun Colin. author.

(1)

Tu, K. N. (King-Ning), 1937- author.

(1)

Vasudeva Reddy, T., editor.

(1)

Villanucci, Robert S., 1944-

(1)

Voyiadjis, George Z. editor.

(1)

Vélez, Paris, author.

(1)

Walker, C. A. (Colin A.)

(1)

Whitaker, Jerry C.

(1)

Willander, M., author.

(1)

Wolter, Klaus-Jürgen. editor.

(1)

(1)

Wong, C. P. editor.

(1)

Wong, C.P. editor.

(1)

Zapka, Werner, editor.

(1)

Zha, Jun-Wei, editor.

(1)

Zheng, Li-Rong, author.

(1)

Zou, Zhuo, author.

(1)

Language

(49)

Publication Date

-

(4)

(4)

(4)

(3)

(3)

(3)

(3)

(3)

(3)

(2)

(2)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Electronic packaging.

(22)

Electronic books.

(11)

(8)

TECHNOLOGY & ENGINEERING.

(6)

Mise sous boîtier (Électronique)

(5)

Microelectronics.

(4)

Solder and soldering.

(4)

Chip scale packaging.

(3)

Electronic apparatus and appliances -- Design and construction.

(3)

(3)

Extreme environments.

(3)

Microelectronic packaging.

(3)

Nanotechnology.

(3)

Optical materials.

(3)

TECHNOLOGY & ENGINEERING -- Mechanical.

(3)

(2)

Electronic apparatus and appliances -- Reliability.

(2)

Electronic packaging

(2)

Electronic packaging -- Materials.

(2)

Electronics -- Materials -- Permeability.

(2)

(2)

(2)

Sealing (Technology)

(2)

Semiconductors.

(2)

Surfaces (Physics).

(2)

(1)

(1)

Aerospace engineering.

(1)

Aliments -- Industrie et commerce -- Grande-Bretagne -- Qualité -- Contrôle.

(1)

Amplifiers (Electronics).

(1)

(1)

Biomedical engineering.

(1)

(1)

Boîtiers à puce.

(1)

Building materials.

(1)

COMPUTERS / Programming / Algorithms

(1)

Capteurs intelligents.

(1)

Ceramic materials.

(1)

(1)

Chip scale packaging

(1)

Circuits imprimés.

(1)

Circuits intégrés -- Intégration sur la plaquette.

(1)

Circuits intégrés.

(1)

(1)

Classical Mechanics.

(1)

Conducting polymers.

(1)

Contamination (Technology)

(1)

(1)

Dichtung (Technik)

(1)

(1)

Drugs -- Testing.

(1)

Détecteurs à micro-ondes.

(1)

Eau -- Qualité -- Mesure.

(1)

Eau -- Qualité -- Télédétection.

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

(1)

Electromagnetics & Microwaves

(1)

Electronic Packaging

(1)

Electronic apparatus and appliances

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic apparatus and appliances.

(1)

Electronic ceramics.

(1)

Electronic circuits -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Defects -- Prevention.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronics -- Materials -- Effect of temperature on.

(1)

Electronics -- Materials.

(1)

Elektronik aygıtlar ve aletler -- Tasarım ve yapım.

(1)

Elektronik paketleme -- Kusurlar -- Korunma.

(1)

Elektronik paketleme.

(1)

Elektronisches Bauelement.

(1)

Engineering -- Handbooks, manuals, etc.

(1)

Engineering Mechanics.

(1)

Engineering design.

(1)

Environmental protection.

(1)

Environmental testing.

(1)

(1)

Extreme environments

(1)

Fabrika sağlıklaştırımı.

(1)

Factory sanitation.

(1)

Field-effect transistors.

(1)

Food industry and trade -- Great Britain -- Quality control.

(1)

Food industry and trade -- Quality control

(1)

Gallium arsenide.

(1)

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Heat resistant materials

(1)

Heat resistant materials.

(1)

Ink-jet printing

(1)

Ink-jet printing.

(1)

Integrated circuits -- Wafer-scale integration

(1)

Integrated circuits -- Wafer-scale integration.

(1)

Intelligent sensors

(1)

Intelligent sensors.

(1)

Interconnects (Integrated circuit technology) -- Design and construction.

(1)

Kontaminasyon (Teknoloji)

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Materials at high temperatures

(1)

Materials at high temperatures.

(1)

Matériaux réfractaires.

(1)

Matériaux à hautes températures.

(1)

Mechanics, Applied.

(1)

(1)

Microelectromechanical systems.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave detectors

(1)

Microwave detectors.

(1)

Microwave transistors.

(1)

Mikroelektronik.

(1)

Milieux extrêmes.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique) -- Matériaux.

(1)

Mixing circuits.

(1)

Moire method -- Case studies.

(1)

(1)

Nanostructured materials.

(1)

Optical detectors -- Industrial applications.

(1)

Optoelectronic devices.

(1)

Optoelectronics.

(1)

Optoelektronik.

(1)

Oscillators, Electric.

(1)

Particles (Nuclear physics).

(1)

Passive components.

(1)

(1)

(1)

Polymères conducteurs.

(1)

Printed electronics

(1)

Printed electronics.

(1)

Production management.

(1)

Production of electric energy or power.

(1)

Quality Control.

(1)

Quality control -- Optical methods.

(1)

Sealing (Technology).

(1)

Semi-conducteurs.

(1)

Semiconductor industry -- Production control.

(1)

(1)

Semiconductors -- Design and construction.

(1)

(1)

Silicon -- Electric properties

(1)

Silicon -- Electric properties.

(1)

Silicones -- Propriétés électroniques.

(1)

Solder and soldering

(1)

Solid Mechanics.

(1)

Solid state electronics

(1)

Solid state electronics.

(1)

(1)

(1)

Space vehicles -- Electronic equipment -- Design and construction.

(1)

Structural Materials.

(1)

(1)

Systems engineering.

(1)

Systèmes électroniques.

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Semiconductors.

(1)

TECHNOLOGY & ENGINEERING -- Food Science.

(1)

TECHNOLOGY / Engineering / Civil

(1)

TECHNOLOGY / Engineering / Mechanical

(1)

Telecommunication.

(1)

(1)

Water quality -- Measurement

(1)

Water quality -- Measurement.

(1)

Water quality -- Remote sensing

(1)

Water quality -- Remote sensing.

(1)

(1)

(1)

(1)

Électronique -- Matériaux -- Effets de la température sur.

(1)

Électronique de l'état solide.

(1)

Material Type

Shelf Location

Beytepe General Collection

Electronic Library

Taylor Francis E-Book Collection

Wiley E-Book Collection

Library

Beytepe Library

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25.

Cover image for Electronic enclosures, housings and packages

Electronic enclosures, housings and packages

Electronic enclosures, housings and packages

Author

Süli, Frank, author.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect https://www.sciencedirect.com/science/book/9780081023914

Format:

Availability

Online Library~1

Available:
Copies:

26.

Cover image for Harsh environment electronics : interconnect materials and performance assessment

Harsh environment electronics : interconnect materials and performance assessment

Harsh environment electronics : interconnect materials and performance assessment

Author

Sharif, Ahmed, editor.

Preferred Shelf Number

TK7871

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527813964

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27.

Cover image for Advances in embedded and fan-out wafer level packaging technologies

Advances in embedded and fan-out wafer level packaging technologies

Advances in embedded and fan-out wafer level packaging technologies

Author

Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.

Preferred Shelf Number

TK7870.17 .A38 2019

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991

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28.

Cover image for Smart electronic systems : heterogeneous integration of silicon and printed electronics

Smart electronic systems : heterogeneous integration of silicon and printed electronics

Smart electronic systems : heterogeneous integration of silicon and printed electronics

Author

Zheng, Li-Rong, author. Tenhunen, Hannu, author. Zou, Zhuo, author.

Preferred Shelf Number

TK7872 .P75

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527691685

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29.

Cover image for Food and drink--good manufacturing practice : a guide to its responsible management

Food and drink--good manufacturing practice : a guide to its responsible management

Food and drink--good manufacturing practice : a guide to its responsible management

Author

Manning, Louise, editor.

Preferred Shelf Number

TP369 .G7

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119388494

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30.

Cover image for Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Author

Voyiadjis, George Z. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-1-4614-5589-9

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31.

Cover image for Extreme environment electronics

Extreme environment electronics

Extreme environment electronics

Author

Cressler, John D. Mantooth, H. Alan, 1963-

Preferred Shelf Number

TK7870.24 .E97 2013

Electronic Access

Click here to view.

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32.

Cover image for Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Author

Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9781437778779

Format:

Availability

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33.

Cover image for LED packaging for lighting applications design, manufacturing, and testing

LED packaging for lighting applications design, manufacturing, and testing

LED packaging for lighting applications design, manufacturing, and testing

Author

Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-

Preferred Shelf Number

ONLINE

Electronic Access

Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643

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34.

Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Author

Gilleo, Ken.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

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35.

Cover image for Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Author

Jamnia, Ali, 1961- author.

Preferred Shelf Number

TK7870.15 .J36 2009

Electronic Access

Click here to view.

Format:

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36.

Cover image for Ceramic interconnect technology handbook

Ceramic interconnect technology handbook

Ceramic interconnect technology handbook

Author

Barlow, Fred D. Elshabini, Aicha.

Preferred Shelf Number

TK7871.15 .C4 C44 2007

Electronic Access

Click here to view.

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