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37. 
Cover image for Data-Driven Scheduling of Semiconductor Manufacturing Systems
Data-Driven Scheduling of Semiconductor Manufacturing Systems
Author 
Li, Li. author. Yu, Qingyun. author. Lin, Kuo-Yi. author. Ma, Yumin. author. Qiao, Fei. author.
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-7588-2
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38. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
Author 
Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-99-0451-8
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39. 
Cover image for Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Author 
Siano, Pierluigi. editor. Williamson, Sheldon. editor. Beevi, Sabeena. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0915-5
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40. 
Cover image for Switched Inductor Power IC Design
Switched Inductor Power IC Design
Author 
Rincón-Mora, Gabriel Alfonso. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-95899-2
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41. 
Cover image for Recent Advances in Metrology Select Proceedings of AdMet 2021
Recent Advances in Metrology Select Proceedings of AdMet 2021
Author 
Yadav, Sanjay. editor. Chaudhary, K.P. editor. Gahlot, Ajay. editor. Arya, Yogendra. editor. Dahiya, Aman. editor.
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https://doi.org/10.1007/978-981-19-2468-2
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42. 
Cover image for Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Author 
Philippe, Bart. author. Reynaert, Patrick. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-11224-9
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43. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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44. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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45. 
Cover image for Introduction to Avionics Systems
Introduction to Avionics Systems
Author 
Collinson, R.P.G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29215-6
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46. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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47. 
Cover image for Understanding Error Control Coding
Understanding Error Control Coding
Author 
Sanvicente, Emilio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-05840-1
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48. 
Cover image for Security Policy in System-on-Chip Designs Specification, Implementation and Verification
Security Policy in System-on-Chip Designs Specification, Implementation and Verification
Author 
Ray, Sandip. author. Basak, Abhishek. author. Bhunia, Swarup. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-93464-8
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