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37. 
Cover image for Energy Harvesting Trends for Low Power Compact Electronic Devices
Energy Harvesting Trends for Low Power Compact Electronic Devices
Author 
Nella, Anveshkumar. editor. Bhowmick, Anirban. editor. Kumar, Chandan. editor. Rajagopal, Maheswar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-35965-1
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38. 
Cover image for Technological Advancement in Instrumentation & Human Engineering Selected papers from ICMER 2021
Technological Advancement in Instrumentation & Human Engineering Selected papers from ICMER 2021
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Hassan, Mohd Hasnun Arif. editor. Zohari, Mohd Hafizi. editor. Kadirgama, Kumaran. editor. Mohamed, Nik Abdullah Nik. editor. Aziz, Amir. editor.
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https://doi.org/10.1007/978-981-19-1577-2
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39. 
Cover image for Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
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Cocorullo, Giuseppe. editor. Crupi, Felice. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26066-7
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40. 
Cover image for Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Author 
Triwiyanto, Triwiyanto. editor. Rizal, Achmad. editor. Caesarendra, Wahyu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0248-4
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41. 
Cover image for Selected Sensor Circuits From Data Sheet to Simulation
Selected Sensor Circuits From Data Sheet to Simulation
Author 
Baumann, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-38212-4
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42. 
Cover image for Introduction to Electronic Devices
Introduction to Electronic Devices
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Di Natale, Corrado. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-27196-0
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43. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-12818-9
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44. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
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Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0451-8
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45. 
Cover image for Switched Inductor Power IC Design
Switched Inductor Power IC Design
Author 
Rincón-Mora, Gabriel Alfonso. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-95899-2
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46. 
Cover image for Applications in Electronics and Computing Systems Proceedings of the 4th International Conference on Applications in Electronics and Computing Systems AECS-2022
Applications in Electronics and Computing Systems Proceedings of the 4th International Conference on Applications in Electronics and Computing Systems AECS-2022
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Dantsevich, Igor. editor. Samoylenko, Irina. editor. (orcid)0000-0001-6907-1403 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20631-3
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47. 
Cover image for Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
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Ng, Leonard W. T. author. Hu, Guohua. author. Howe, Richard C. T. author. Zhu, Xiaoxi. author. Yang, Zongyin. author.
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https://doi.org/10.1007/978-3-319-91572-2
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48. 
Cover image for Multi-run Memory Tests for Pattern Sensitive Faults
Multi-run Memory Tests for Pattern Sensitive Faults
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Mrozek, Ireneusz. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-91204-2
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